Biography:

Dr. Madhavan Swaminathan
Department Head EE, William E. Leonhard Endowed Chair Professor & Director, CHIMES
Penn State University

Madhavan Swaminathan is the Department Head of Electrical Engineering and is the William E. Leonhard Endowed Chair at Penn State University. He also serves as the Director for the Center for Heterogeneous Integration of Micro Electronic Systems (CHIMES), an SRC JUMP 2.0 Center chimes.psu.edu.

Prior to joining Penn State, he was the John Pippin Chair in Microsystems Packaging & Electromagnetics in the School of Electrical and Computer Engineering (ECE), Professor in ECE with a joint appointment in the School of Materials Science and Engineering (MSE), and Director of the 3D Systems Packaging Research Center (PRC) – a graduated NSF-Engineering Research Center (ERC), Georgia Tech (GT). Prior to GT, he was with IBM working on packaging for supercomputers. Prof. Swaminathan’s interdisciplinary research on semiconductor packaging and systems integration over the years have resulted in 650+ technical publications, 200+ invited presentations (seminars, keynotes, panels), 3 books, 5 book chapters, 31 patents, 33 best paper and student paper awards, 5 GT awards, 2 start-ups, and several international recognitions with the recent one being the 2024 IEEE Rao R. Tummala Electronics Packaging Award (technical field award) for “contributions to semiconductor packaging and system integration technologies that improve the performance, efficiency, and capabilities of electronic systems”. He is also the founder of the IEEE Conference on Electrical Design of Advanced Packaging and Systems (EDAPS), a premier conference sponsored by the IEEE Electronics Packaging Society (EPS). He is a Fellow of IEEE, Fellow of the National Academy of Inventors (NAI), Fellow of Asia-Pacific Artificial Intelligence Association (AAIA), and has served as the Distinguished Lecturer for the IEEE Electromagnetic Compatibility (EMC) society. He received his MS and PhD degrees in Electrical Engineering from Syracuse University, USA.

Biography:

Dr. Rohit Sharma is a Research Professor in the School of Electrical Engineering and Computer Science (EECS) at Pennsylvania State University and an Associate Professor (on leave) in the Department of Electrical Engineering at the Indian Institute of Technology (IIT) Ropar. He received his B.E. from North Maharashtra University, M.Tech. from Dayalbagh Educational Institute, and Ph.D. from Jaypee University of Information Technology, India. He has also held prestigious postdoctoral research positions at Seoul National University, South Korea, and the Georgia Institute of Technology, USA.
Dr. Sharma's research interests include high-speed chip-to-chip and on-chip interconnects, graphene-based nano-interconnects, signal integrity, thermal integrity, and advanced electronic packaging technologies. He serves as an Associate Editor of the IEEE Transactions on Components, Packaging and Manufacturing Technology and has contributed extensively to leading IEEE conferences, including ECTC, EPEPS, SPI, and EDAPS. He previously served as the Chair of the IEEE Electronics Packaging Society (EPS) Technical Committee on Electrical Design, Modeling, and Simulation and is a Senior Member of IEEE, recognized for his significant contributions to electronics packaging research and education.

Biography:

Mr. Bala Prasad Peddigari is a Principal Consultant and Technology Head for Digital Initiatives at Tata Consultancy Services (TCS), with over 19 years of experience in enterprise architecture, digital transformation, and scalable technology solutions. He is recognized as a thought leader and practitioner in enterprise platform solutions, performance engineering, and cloud-native architectures. Bala has been instrumental in driving digital technology initiatives across Cloud Computing, Internet of Things (IoT), Cognitive Services, DevOps, Data Science, and Analytics within TCS. In his current role, he leads strategic digital initiatives and actively fosters the architecture and technology community through coaching, mentoring, and professional development programs.He holds a Master’s degree in Computer Applications from University College of Engineering, Osmania University, where he secured the University First Rank. Bala is an Open Group Master IT Certified Architect and serves as a Board Member of the Open Group Certifying Authority. He has published papers in IEEE, received recognition for his expertise in cloud architecture, and is a frequent speaker at Open Group conferences and technology events. He is also a Working Group member for Cloud and Open Platform initiatives at the Open Group, a Managing Committee member of CSI Hyderabad Section, and Chairman of the IEEE Computer Society Chapter, Hyderabad Section.

Biography:

Dr. Yarlagadda Padma Sai is a Professor in the Department of Electronics and Communication Engineering and Dean of Students Progression at VNR Vignana Jyothi Institute of Engineering and Technology (VNR VJIET), Hyderabad. He has over 24 years of teaching, 14 years of research, and 6 years of industry experience in Electronics and Communication Engineering. He earned his Ph.D. in Biomedical Signal Processing and has expertise in Signals and Systems, Digital Signal Processing (DSP), VLSI Signal Processing, and Biomedical Signal Processing. He has played a significant role in curriculum development and academic planning since the institution attained autonomous status. Dr. Padma Sai has actively contributed to IEEE through organizing conferences, workshops, technical events, and securing professional grants. He also serves as a reviewer for reputed journals and international conferences. His academic, research, and professional contributions continue to support innovation, student development, and industry-academia collaboration.