Co-Packaged Optical Transceivers for HPC, Data Center and Ai Applications
#co-packaging
#VCSEL
#SiPh
#AI
#high-performance-computing
#data-center
#fiber-optics
This talk will cover the status of fiber optic transceiver co-packaging efforts, both VCSEL- and SiPh-based, where they fit into the Ethernet switch market and the evolving Computer IO market, and how these technologies are advancing HPC (High Performance Computing), Data Center, and AI applications. The emphasis will be on new requirements and challenges driven by AI systems.
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- Starts
14 July 2026 07:00 AM UTC
- Ends
09 October 2026 07:30 PM UTC
- No Admission Charge
Speakers
Dan Kuchta of Nvidia
Biography:
Daniel M. Kuchta (IEEE Fellow 2019) is a Principal Hardware System Architect at Nvidia. Previously he was a Research Staff Member in the Communications and Computation Subsystems Department at the IBM Thomas J. Watson Research Center since 1992. He received B.S., M.S., and Ph.D. degrees in Electrical Engineering and Computer Science from the University of California at Berkeley in 1986, 1988, and 1992, respectively. While at IBM Research he has worked on high-speed VCSEL characterization, multimode fiber links, parallel fiber optic links, and optics co-packaging technology research. He received IEEE J. of Lightwave Technology best paper award in 2014, and in 2018 was the first recipient of the IEEE Photonics Technology Letters best paper award. He was Technical Program Chair for OFC 2018 and General Chair for OFC 2020. Dr. Kuchta is an author/coauthor of more than 145 technical papers and inventor/co-inventor of at least 40 patents.
Address:United States
