Scaling AI Infrastructure through Silicon Photonics and Advanced Packaging Integration
AI workloads have supercharged the need for high bandwidth, density, and power-efficient connectivity in next-gen datacenters, spanning scale-out, scale-across, and now increasingly scale-up architectures. This talk explores how silicon photonics, advanced packaging and co-integration represent the necessary innovations to overcome traditional signal integrity limits and deliver the required bandwidth density for massive-scale compute.
The schedule is as follows:
4-4.30 pm - Networking
4.30-6 pm - Lecture
Date and Time
Location
Hosts
Registration
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- 6455 Lusk Blvd
- San Diego, California
- United States 92121
- Building: Qualcomm Building Q Auditorium
- Starts 03 September 2026 08:00 PM UTC
- Ends 15 September 2026 10:00 PM UTC
- No Admission Charge
Speakers
Hiren D. Thacker
Biography:
Dr. Hiren D. Thacker is Senior Manager of Packaging Technology & Quality at Cisco Systems, focused on silicon photonic packaging and co-integration for next generation switching systems. Prior to joining Cisco, he was Chief Technology Officer at Nanovision Biosciences where he headed engineering of an implantable retinal prosthesis for restoring vision in blind patients. Earlier in his career, he was a member of the R&D Labs at Oracle/Sun Microsystems and led hybrid integration and packaging technology pathfinding for high bandwidth density silicon photonic interconnects and co-packaged optics. Dr. Thacker is a Senior Member of the IEEE, a former Associate Editor of the IEEE Transactions on Components, Packaging, and Manufacturing Technologies, and a member of the IEEE ECTC Photonics Committee. He has over 45 patents issued or pending and has co-authored over 100 peer-reviewed technical publications. Dr. Thacker received the B.S., M.S., and Ph.D. degrees in electrical and computer engineering from the Georgia Institute of Technology in Atlanta, USA.
Agenda
4-4.30 pm - Networking
4.30-6 pm - Lecture