IEEE DAY 2026 Malaysia Section
Dear IEEE Malaysia Section Members, Technical Chapters, & Student Branches,
Join us in celebrating IEEE Day 2026 as we bring together engineers, researchers, and innovators under the global theme: " Leveraging Technology for a Better Tomorrow"
We invite everyone to experience a full day of exciting exhibitions, inspiring talks, hands-on STEM activities, networking opportunities, and much more.
📅 Event Details:
Date: 17th October 2026 (Saturday)
Time: 8:00 AM – 5:00 PM
Venue: Universiti Kuala Lumpur British Malaysian Institute (UniKL BMI), Gombak
🌟Perks:
Exclusive membership offer—IEEE is providing a US$30 discount on new memberships along with various IEEE Society membership promotions during the event, plus complimentary refreshments for all guests, a dedicated food truck zone, and high-energy interactive programs!
Come and Experience
🔹 Technology Exhibition Booths
🔹 Inspiring Tech Talks
🔹 STEM Activities & Demonstrations
🔹 Industry & Student Networking
🔹 Food Vendors & Food Truck
🔹 IEEE Membership Promotion (US$30 OFF for new members)
🔹 Complimentary Refreshments
🎟️ FREE ENTRY | OPEN TO THE PUBLIC
Students • Professionals • Researchers • Families • Technology Enthusiasts
Date and Time
Location
Hosts
Registration
-
Add Event to Calendar
- Batu 8
- Jalan Sungai Pusu
- Gombak, Selangor Darul Ehsan, Selangor
- Malaysia 53100
- Starts 08 September 2026 04:00 PM UTC
- Ends 16 October 2026 04:00 PM UTC
- No Admission Charge
Speakers
Electronics Packaging in the Age of AI: Reliability, Innovation and the Future of the Semiconductor Industry
Prof. Pradeep Lall, Ph.D. is the MacFarlane Endowed Professor of Mechanical Engineering and Director of the Electronics Packaging Research Institute (EPRI) at Auburn University, Alabama, USA. He is an IEEE Fellow, ASME Fellow, and Fellow of the Alabama Academy of Sciences, and has authored over 600 journal and conference publications spanning electronics packaging, reliability engineering, and semiconductor systems. Prof Lall serves as an IEEE EPS Member-at-Large (2026 to 2027) and has previously served on the IEEE EPS Board of Governors from 2019 to 2024, before being re-elected for the term 2026 to 2028. He is an active participant in the IEEE EPS Distinguished Lecturer Programme, with registered lecture topics covering Semiconductor Packaging, Modeling and Simulation, Reliability in Harsh Environments, Shock/Drop/Vibration, Flexible Hybrid Electronics, Additive Manufacturing, Prognostics and Health Management, LEDs, and Micro CT Measurements.
His research at EPRI spans over two decades, with particular focus on the reliability of electronics in extreme environments, AI-driven prognostics and health management, and emerging packaging technologies. He has served as Principal Investigator on programmes with NASA, the US Department of War, and various industry partners, and is a recipient of numerous awards including the ASME Avram Bar-Cohen Memorial Medal and the IEEE Exceptional Technical Achievement Award. Prior to his academic career, Prof. Lall gained industry experience at Motorola, working on wireless communications products.
Address:Malaysia
Topic: AI Can Write the Code. Who Designs the System?
Dr. Mirza Rayana Sanzana is a Lecturer (Teaching and Research) at the School of Information Technology, Monash University Malaysia, where she teaches Software Engineering and works across applied AI, responsible AI, intelligent decision systems, and AI-enabled engineering. She is also an IEEE Region 10 Ambassador, a speaker at technology, AI, and innovation events, and an HRD Corp-accredited trainer in AI. Her interests centre on how AI is changing the way systems are designed, engineered, governed, and used in practice.
Address:Malaysia
Advanced Packaging Talk
Dr. Eu Poh Leng
Senior Director of External Package Innovation, NXP Semiconductors Malaysia
29 years of semiconductor industry experience
Expertise in Advanced Packaging, NTI/NPI & Technology Development
88 Technical Papers | 28 Filed Patents | 12 Issued Patents
Former Chair, IEEE EPS Malaysia Chapter
Recipient of IEEE Malaysia Women in Engineering Award & Outstanding Industry Volunteer Award
Agenda
- 8:30 AM – 9:00 AM — Registration & Light Refreshments — Venue XX
- 9:00 AM – 5:00 PM — Exhibition Booths (All-Day Feature) — Main Hall
- 9:00 AM – 12:00 PM — Technical Chapter Parallel Sessions — Refer to table below
- 12:30 PM – 2:00 PM — Lunch Break & Networking — Dining Area / Foyer
- 2:00 PM – 2:30 PM — Opening Ceremony & Certificate Presentation — Main Hall
- 2:30 PM – 3:00 PM — IEEE Day Cake Cutting Ceremony — Main Hall
- 3:00 PM – 5:00 PM — Interactive Activity Session — Main Hall