From February 28 to March 4, 2027, IWIPP will be held in Kokura, Kitakyushu, Japan. Established in 1998 by Professor Shenai of the University of Illinois, IWIPP has focused on advanced power packaging and integration technologies that maximize the performance of power semiconductor devices. With the rapid expansion of AI data centers and electric vehicles, these technologies have become more important than ever. IWIPP 2027 will bring together researchers and engineers from around the world to discuss the latest developments in the field.

IMPORTANT DATES

      October 9, 2026: abstract deadline

      November 26, 2026: Notification

      January 18, 2027: Final manuscript

KEYNOTES

      Prof. Johann W. Kolar, ETH Zurich, / TU Wien

      Prof. Victor Veliadis, North Carolina State University

INVITED SPEAKERS

      Dr. Peter Friedrichs, Infineon Technologies

      Dr. Jacek Rudzki, Semikron Danfoss GmbH

      Prof. Ivana Kovacevic, ETH Zurich

TUTORIAL

      Prof. Nando Kaminski, University of Bremen

      Prof. Yoshikazu Takahashi, Tohoku University

      Prof. Thomas Ebel, University of Southern Denmark

      Dr. Lars Böttcher, Fraunhofer IZM

      Prof. Weijia Zhang, HKUST, Hong Kong