From Chip to System: A Holistic Approach to 2D Scalable Low-Loss D-Band Active Phased Array Realization
From Chip to System: A Holistic Approach to 2D Scalable Low-Loss D-Band Active Phased Array Realization
Join us for a webinar by Prof. Kamil Yavuz Kapusuz (Senior Member, IEEE) from IMEC and Ghent University, Belgium.
Discover a holistic approach to D-band (110–170 GHz) active phased arrays, combining circuit, antenna, and packaging co-design to enable low-loss, scalable solutions for next-generation wireless communications and sensing. The talk will showcase prototype results demonstrating wide-angle beam steering and data rates up to 100 Gb/s.
📅 Wednesday, 11 November 2026
🕒 16:00–17:00
💻 Online webinar
We look forward to seeing you there!
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- Starts 04 November 2026 12:00 AM UTC
- Ends 11 November 2026 12:00 AM UTC
- No Admission Charge
Speakers
Kamil Kapusuz
From Chip to System: A Holistic Approach to 2D Scalable Low-Loss D-Band Active Phased Array Realization
Kamil Yavuz Kapusuz (Senior Member, IEEE) received the M.Sc. degree in Electrical Engineering from Atilim University, Ankara, Turkey, in 2013, and the Ph.D. degree in Electrical Engineering from the Electromagnetics Group, Department of Information Technology, Ghent University, Ghent, Belgium, in 2021.
Since 2022, he has been a Senior Researcher in Electromagnetics at IMEC, Leuven, Belgium, and since 2026, he has been a Professor at Ghent University, Ghent, Belgium. From 2014 to 2016, he was a Senior Antenna Engineer at Remote Sensing Technologies, Ankara, Turkey. From 2021 to 2022, he was a Visiting Scientist at the IETR Laboratory, CNRS, Rennes, France. From 2021 to 2026, he was a Postdoctoral Fellow at Ghent University, Ghent, Belgium. His research interests include the analysis and design of quasi-optical systems, leaky-wave antennas, near-field focusing techniques, in-body and on-body communication systems, active, reconfigurable, and unconventional millimeter-wave and sub-terahertz phased arrays, as well as electromagnetic modeling and optimization of 2.5-D and 3-D RF packaging architectures.
Dr. Kapusuz received the URSI Young Scientist Award at the 2021 URSI General Assembly.