harsha of CMTI

Speaker: Harsha S.
Affiliation: : Scientist and Group Head (Sensor Technology Development Centre), Central Manufacturing Technology Institute, Bengaluru

Biography:

Personal Information:

Current Position:  Scientist and Group Head (Sensor Technology Development Centre) Organization
Central Manufacturing Technology Institute ( Bengaluru, India 
Field of Expertise Sensor Technology Development
Professional Summary:
• Harsha joined CMTI in 2011 and has grown with the institute’s work in microsystems. He began in vision based inspection and metr ology, then moved into MEMS, sensors and semiconductor packaging, which is where much of his work sits today.
•He was a driving force behind the establishment of STDC’s cleanroom facilities: ISO 5, ISO 6 and ISO 7 spaces across 1,000 squar e metres , with over 30 process tools. Together they enable MEMS fabrication, characterisation and packaging at micrometre scale precision.
•His technical expertise covers sensor design, thin film deposition and lithography, die level and wafer level packaging, 3D inte gration, wire bonding, flip chip bonding and X ray microscopy. His team develops sensor solutions for machine tools, automotive, aerospace, biomedical and health care applications. Current
projects include a carbon nanotube based UV sensor for monitoring combustion in engines, self cleaning fabric coatings, and an a ssessment of how silicon photonics and diamond chip manufacturing could be supported by Indian machinery and supply chains.
•Harsha holds an M.Tech in VLSI Design and Embedded Systems and is pursuing his PhD on miniaturized thermal sensors. He has au tho red many papers in national and internationaljournals and conferences, and he regularly conducts training and workshops on semiconductor packaging. He also works closely wit h industry and academia on collaborative R&D.
Key Areas of Expertise: Semiconductor and Microsystems Proficient in designing and fabricating advanced semiconductor devices and microsystems Lithography and Thin Film Deposition Expertise in various lithography techniques and thin film deposition processes Bonding Methodologies Skilled in multiple bonding techniques, including flip chip bonding and wire bonding, ensuring compliance with military standards Semiconductor Packaging Well versed in 2 D, 3 D, and wafer level packaging  Characterization Techniques Experienced in validating bond strength through push, pull, shear, and vector methods 

Certifications Certified Cleanroom Professional by ISHRAE 

Research Contributions
Harsha has been instrumental in establishing several niche technologies that have led to developing specific devices for strategic applications His scholarly work includes over 25 publications in semiconductor technology, microsystems, and sensor development He contributes significantly to sensor technology through innovative research and development at CMTI

Address:CMTI, , Bengaluru, India