3D Radio-Frequency to Millimeter Wave Heterogeneous System Integration: Emerging Nanotechnology for RF Nanopackaging
Department of Electronics & Communication Engineering and IEEE Nanotechnology Council Chapter, IIT-Roorkee are jointly organizing a Distinguished Lecture by Prof. Dominique Baillargeat, University of Limoges, France.
Department of Electronics & Communication Engineering and IEEE Nanotechnology Council Chapter, IIT-Roorkee are jointly organizing a Distinguished Lecture by Prof. Dominique Baillargeat, University of Limoges, France.
Venue: E&ICT Smart Classroom (N-316), 2nd Floor, E&CE Dept., IIT Roorkee
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- Date: 31 Oct 2018
- Time: 04:00 AM UTC to 05:30 AM UTC
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- E&ICT Smart Classroom (N-316), 2nd Floor
- E&CE Dept., IIT Roorkee
- Roorkee, Uttaranchal
- India 247667
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Department of Electronics & Communication Engineering and IEEE Nanotechnology Council Chapter, IIT-Roorkee
- Starts 01 October 2018 06:30 AM UTC
- Ends 30 October 2018 06:30 AM UTC
- No Admission Charge
Speakers
Prof. Dominique Baillargeat of University of Limoges, France
3D Radio-Frequency to Millimeter Wave Heterogeneous System Integration: Emerging Nanotechnology for RF Packaging
D. BAILLARGEAT (51) is Senior Member IEEE. He is currently IEEE Nanotechnology Council (NTC) Distinguished Lecturer. D Baillargeat is Professor at the University of Limoges (France). He is currently the Director of XLIM a joint research institute of CNRS and University of Limoges and the Director of Lab of Excellence SIGMA_LIM. From September 2009 to August 2013 he was the Director of the research laboratory CINTRA in Singapore and visiting Professor at NTU Singapore. D Baillargeat has done lot of research activities on CAD applied to the packaging and the design of RF and mmW devices. His research work is mainly in the following areas: (1) Modeling and design of RF and mmW components and modules, (2) Use of specific technologies (muliti-layer, additive, nanotechnologies) for the design of RF and mmW components, (nano)packaging (interconnect), 3D integration. Prof Baillargeat have been involved in many projects (past and present) either as XLIM scientific responsible or collaborator through funding from the ANR, European Community, ESA, CNES or with industrial partners (Thales, EADS etc). He has been the advisor of 30 graduated PhD students. D Baillargeat has co-authored more than 70 articles in international journals and books, and 200 communications in international conferences.
Biography:
D. BAILLARGEAT (51) is Senior Member IEEE. He is currently IEEE Nanotechnology Council (NTC) Distinguished Lecturer. D Baillargeat is Professor at the University of Limoges (France). He is currently the Director of XLIM a joint research institute of CNRS and University of Limoges and the Director of Lab of Excellence SIGMA_LIM. From September 2009 to August 2013 he was the Director of the research laboratory CINTRA in Singapore and visiting Professor at NTU Singapore. D Baillargeat has done lot of research activities on CAD applied to the packaging and the design of RF and mmW devices. His research work is mainly in the following areas: (1) Modeling and design of RF and mmW components and modules, (2) Use of specific technologies (muliti-layer, additive, nanotechnologies) for the design of RF and mmW components, (nano)packaging (interconnect), 3D integration. Prof Baillargeat have been involved in many projects (past and present) either as XLIM scientific responsible or collaborator through funding from the ANR, European Community, ESA, CNES or with industrial partners (Thales, EADS etc). He has been the advisor of 30 graduated PhD students. D Baillargeat has co-authored more than 70 articles in international journals and books, and 200 communications in international conferences
Agenda
Whether for niche applications (military, space, medical) or for high volume applications (portable devices, entertainment, automobile) the design of RF subsystems requires balancing packaging choices to meet demanding customer targets of cost, size and high performance.
In this context, numerous efforts have recently focused on heterogeneous 3D integration of components to subsystems for future RF to mmW applications. However major challenges remain and as a response, RF nanotechnology offer new opportunities. It enables new nanomaterials with unique RF properties due to their small dimensions and good transport properties for more efficient interconnects, EM shielding and thermal management. In this presentation, the focus will be on the use of carbon nanotubes for new efficient RF interconnects and EM shielding.
The talk will start by introducing specific modelling tools we have develop for such applications. Then several examples regarding carbon nanotubes dedicated to flip-chip bounding, wireless interconnect, EM shielding, and air-filled waveguide will be presented and discussed. Experimental works will validate the modelling approach and innovative proofs of concept.