Webinar on Ansys Electronics 2022 R1: Phi Plus meshing, Automotive Radar Surface Roughness, and Broadband Fast Sweep
Ansys Electronics 2022 R1
• Phi Plus meshing technology introduced in 2021 R2 brought a significant breakthrough in speed and capacity for 3D IC package challenges, especially those with wire bonds. In 2022 R1, Phi-plus technology is now fully integrated into the powerful HFSS Mesh Fusion technology which will allow HFSS users to solve even more complex and large-scale electromagnetic system designs.
• An automotive radar surface roughness model in HFSS SBR+ provides an efficient method for modeling rough surface non-specular reflection such as from asphalt or concrete boosting the realism of radar simulation outputs.
• Broadband Fast Sweep provides faster solutions with less computational effort by requiring fewer solved basis points to deliver broadband simulation outputs
Date and Time
Location
Hosts
Registration
- Date: 09 Mar 2022
- Time: 07:00 PM UTC to 08:00 PM UTC
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- Starts 25 February 2022 12:15 AM UTC
- Ends 09 March 2022 07:00 PM UTC
- No Admission Charge
Speakers
Dr. Laila Salman
Ansys 2022 R1 highlights
Biography:
Dr. Laila Salman received the B.S. and M.S. degrees in electronics and communication engineering from Cairo University, Giza, Egypt, in 2003 and 2005, respectively, and the PhD. Degree in electromagnetic and antenna design from the University of Mississippi, MS, USA in 2009. She also worked as a post-doctoral student at the Université de Quebec en Outaouais, Gatineau, QC, Canada till 2010. Her research was on dielectric resonator antennas, wearable antennas, microwave and millimeter-wave circuits and systems, microwave imaging for early detection of breast cancer and scattering from left-handed metamaterials.
Dr. Salman joined Ansys Canada Ltd. in August 2010 as a Lead Technical Services Specialist for High Frequency Electromagnetics. Her current expertise is mainly in high frequency RF microwave applications, antenna design, 5G & millimeter wave applications, Automotive Radar, and IoT Applications.