Co-packaging of Optics for HPC (High Performance Computing) and Datacenters

#circuits #analog #low-noise #photonics #optical #interconnects
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This talk will cover high speed fiber optics for Data Centers and High Performance Computing with a focus on co-packaging for these applications. It will highlight the different requirements between Data Center and High Performance Computing with regards to optical interconnect.  A particular emphasis will be on IBM’s project MOTION, a U.S. government sponsored program  to develop co-packaged optics for both of these applications  with a requirement for ultra-low energy consumption.


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  • Date: 03 Nov 2022
  • Time: 04:00 PM to 05:00 PM
  • All times are (UTC-04:00) Eastern Time (US & Canada)
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  • Starts 25 October 2022 04:25 PM
  • Ends 03 November 2022 04:25 PM
  • All times are (UTC-04:00) Eastern Time (US & Canada)
  • No Admission Charge

  Speakers

Dr. Kuchta of IBM

Biography:

Daniel M. Kuchta  (IEEE Fellow 2019) is a Research Staff Member in the Communications and Computation Subsystems Department at the  IBM Thomas J. Watson Research Center. He received B.S., M.S., and Ph.D. degrees in Electrical Engineering and Computer Science  from the University of California at Berkeley in 1986, 1988, and 1992, respectively. He subsequently joined IBM at the Thomas J. Watson Research Center, where he has worked on high-speed VCSEL characterization, multimode fiber links, and parallel fiber optic link research. He received IEEE J. of Lightwave Technology best paper award in 2014 and in 2018 was the first recipient of the IEEE Photonics Technology Letters best paper award.  He was Technical Program Chair OFC 2018 and General Chair for OFC 2020. Dr. Kuchta is an author/coauthor of more than 145 technical papers and inventor/co-inventor of at least 40 patents.