Increasing Role of Silicon Photonics and Criticality of Advanced Packaging Technologies to Meet Future Compute Demands

#photonics #heterogeneous #integration #2.5D #3D #advanced #packaging

As the demand for high-performance computing continues to surge, driven largely by advances in artificial intelligence and other data-intensive applications, the semiconductor industry faces growing challenges in meeting these requirements. Traditional approaches, constrained by the slowing of Moore’s Law and the end of Dennard Scaling, are proving inadequate in addressing the exponential increase in compute and bandwidth needs. Silicon Photonics is emerging as a key technology to overcome these limitations. By leveraging the unique properties of silicon for optical communication, Silicon Photonics can offer significant improvements in data transmission speeds and energy efficiency compared to conventional electrical interconnects. This technology has the potential to reduce latency and power consumption, making it a compelling solution for next-generation data centers and high-performance computing systems.
Advanced Packaging Technologies are equally critical in this evolving landscape. As chips become more complex and power-hungry, innovative packaging solutions such as chiplets and advanced integration methods are essential to manage power consumption and thermal issues while enhancing performance. These technologies enable more efficient use of silicon area, improved thermal management, and higher bandwidth connections between components. In this talk, we will explore how Silicon Photonics and advanced packaging technologies are not just complementary but essential to addressing the challenges of future compute demands. We will discuss the current state of these technologies, their potential to transform the semiconductor industry, and the ongoing efforts to integrate them into scalable, high-performance systems.