Fundamentals of Electrical Design for Advanced Packaging

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Dear All,
 
  The IEEE joint chapter of EDS and SSCS, Gujarat section is organizing an Expert Talk on " Fundamentals of Electrical Design for Advanced Packaging" on 7th March 2025 from 4 to 5pm at DA-IICT Gandhinagar, Gujarat India. 
It can be also attended through the online mode.
 
The Speaker of the Talk is Dr. Rohit Sharma, IIT Ropar
 
   The Expert Session is free to attend, however it is compulsory to register.
 
For Registration, please register through the below link or scan the given QR code.
 
https://forms.gle/N8XRF7XQeFQErLHV9
 

IEEE EDS and SSCS, Gujarat Section 



  Date and Time

  Location

  Hosts

  Registration



  • Date: 07 Mar 2025
  • Time: 10:30 AM UTC to 11:30 AM UTC
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  • DA-IICT Gandhinagar
  • Gandhinagar, Gujarat
  • India 382007
  • Building: RC Preview Room

  • Contact Event Hosts
  • Co-sponsored by Dr. Yash Agrawal
  • Survey: Fill out the survey
  • Starts 05 March 2025 08:30 AM UTC
  • Ends 07 March 2025 10:30 AM UTC
  • No Admission Charge


  Speakers

Dr. Rohit Sharma of IIT Ropar, Punjab, India

Topic:

Fundamentals of Electrical Design for Advanced Packaging

Dear All,
 
  The IEEE joint chapter of EDS and SSCS, Gujarat section is organizing an Expert Talk on " Fundamentals of Electrical Design for Advanced Packaging" on 7th March 2025 from 4 to 5pm at DA-IICT Gandhinagar, Gujarat India. 
It can be also attended through the online mode.
 
The Speaker of the Talk is Dr. Rohit Sharma, IIT Ropar
 
   The Expert Session is free to attend, however it is compulsory to register.
 
For Registration, please register through the below link or scan the given QR code.
 
https://forms.gle/N8XRF7XQeFQErLHV9
 

IEEE EDS and SSCS, Gujarat Section 

Biography:

Rohit Sharma joined the Electrical Engineering department at IIT Ropar in 2012, where he is currently a professor. In the past, he has been a Visiting Professor at the Small-Scale Systems Integration and Packaging Center, Binghamton University (May - Jul 2022), and the Packaging 
Research Center, Georgia Institute of Technology (Sep 2022 - Feb 2023). He was a Research Professor in the Department of Electrical Engineering at Pennsylvania State University, USA (Mar 2023 - Apr 2024). He is a Distinguished Lecturer of the IEEE Electronics Packaging 
Society, an Associate Editor for the IEEE Transactions on Components, Packaging and Manufacturing Technology, and a referee for several 
leading IEEE journals. He is a Program Committee member for major IEEE EPS conferences including ECTC, EDAPS, EPEPS, and SPI. He 
has chaired the IEEE CPMT Technical Committee on Electrical Design, Modeling and Simulation. He is a Fellow of the Institution of 
Engineering and Technology (IET), UK, and the Institution of Electronics and Telecommunication Engineers (IETE), India, as well as a Senior Member of the IEEE.
His research interests include the design of high-speed chip-chip and on-chip interconnects, graphene-based nanoelectronic devices and interconnects, signal and thermal integrity in high-speed interconnects, and the application of machine learning in advanced packaging and 
systems.

Email:

Address:IIT Ropar, , Ropar, Punjab, India, 140001