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Fundamentals of Electrical Design for Advanced Packaging
Dear All,
The IEEE joint chapter of EDS and SSCS, Gujarat section is organizing an Expert Talk on " Fundamentals of Electrical Design for Advanced Packaging" on 7th March 2025 from 4 to 5pm at DA-IICT Gandhinagar, Gujarat India.
It can be also attended through the online mode.
The Speaker of the Talk is Dr. Rohit Sharma, IIT Ropar.
The Expert Session is free to attend, however it is compulsory to register.
For Registration, please register through the below link or scan the given QR code.
https://forms.gle/N8XRF7XQeFQErLHV9
IEEE EDS and SSCS, Gujarat Section
Date and Time
Location
Hosts
Registration
- Date: 07 Mar 2025
- Time: 10:30 AM UTC to 11:30 AM UTC
-
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- DA-IICT Gandhinagar
- Gandhinagar, Gujarat
- India 382007
- Building: RC Preview Room
- Contact Event Hosts
- Co-sponsored by Dr. Yash Agrawal
- Survey: Fill out the survey
Speakers
Dr. Rohit Sharma of IIT Ropar, Punjab, India
Topic:
Fundamentals of Electrical Design for Advanced Packaging
Dear All,
The IEEE joint chapter of EDS and SSCS, Gujarat section is organizing an Expert Talk on " Fundamentals of Electrical Design for Advanced Packaging" on 7th March 2025 from 4 to 5pm at DA-IICT Gandhinagar, Gujarat India.
It can be also attended through the online mode.
The Speaker of the Talk is Dr. Rohit Sharma, IIT Ropar.
The Expert Session is free to attend, however it is compulsory to register.
For Registration, please register through the below link or scan the given QR code.
https://forms.gle/N8XRF7XQeFQErLHV9
IEEE EDS and SSCS, Gujarat Section
Biography:
Rohit Sharma joined the Electrical Engineering department at IIT Ropar in 2012, where he is currently a professor. In the past, he has been a Visiting Professor at the Small-Scale Systems Integration and Packaging Center, Binghamton University (May - Jul 2022), and the Packaging
Research Center, Georgia Institute of Technology (Sep 2022 - Feb 2023). He was a Research Professor in the Department of Electrical Engineering at Pennsylvania State University, USA (Mar 2023 - Apr 2024). He is a Distinguished Lecturer of the IEEE Electronics Packaging
Society, an Associate Editor for the IEEE Transactions on Components, Packaging and Manufacturing Technology, and a referee for several
leading IEEE journals. He is a Program Committee member for major IEEE EPS conferences including ECTC, EDAPS, EPEPS, and SPI. He
has chaired the IEEE CPMT Technical Committee on Electrical Design, Modeling and Simulation. He is a Fellow of the Institution of
Engineering and Technology (IET), UK, and the Institution of Electronics and Telecommunication Engineers (IETE), India, as well as a Senior Member of the IEEE.
His research interests include the design of high-speed chip-chip and on-chip interconnects, graphene-based nanoelectronic devices and interconnects, signal and thermal integrity in high-speed interconnects, and the application of machine learning in advanced packaging and
systems.
Email:
Address:IIT Ropar, , Ropar, Punjab, India, 140001