IEEE CLE Presents: The Donwil Next Generation Infrastructure Series: Impact of AI on Data Center Power

#data-center #data-center-power #high-performance-computing #IEEE #energy
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You’re invited to the next installment of the Donwil Next Generation Infrastructure Series, presented in partnership with IEEE Cleveland State University!

Artificial intelligence is reshaping the data center at a pace never seen before. As AI models grow larger, smarter, and dramatically more power-hungry, organizations are confronting unprecedented infrastructure challenges. Join the Donwil team for a focused, solutions-oriented session that explores how AI is transforming data center power strategies—from capacity planning and energy efficiency to cooling, uptime, and long-term scalability.

 

 


  Date and Time

  Location

  Hosts

  Registration


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  • 2300 Chester Ave
  • Cleveland, Ohio
  • United States 44115
  • Building: Washkewicz
  • Room Number: WH405
  • Click here for Map
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  • Co-sponsored by IEEE Cleveland PES & Computer Society
  • Starts 17 February 2026 05:00 AM UTC
  • Ends 21 March 2026 02:00 AM UTC
  • No Admission Charge

  Speakers

Erik of Donwill

Topic:

The Donwil Next Generation Infrastructure Series: Impact of AI on Data Center Power

Presenter Erik Snowden Strategic Account Executive, Donwil

Erik works closely with engineers, IT leaders, and facility managers to design and deliver high-performance infrastructure solutions for mission-critical environments. With deep expertise in power, cooling, and monitoring systems, he brings a practical, solutions-first approach focused on uptime, efficiency, and scalability. His consultative style and commitment to long-term partnerships make him a trusted advisor for organizations navigating the rapidly evolving demands of modern data centers.




Agenda

What We’ll Cover • The four primary power challenges of High Performance Computing (HPC) applications: – Power availability and permitting challenges – Delivering power to higher rack densities – Dynamic and demanding load profiles – Continuous cooling requirements for liquid-cooled chips • Current-day approaches to supporting these challenges • Energy storage solutions that optimize larger building blocks • Data center architectures best suited for larger building blocks • Future critical power solutions on the horizon


  Media

Donwil_March_20th_Event_IEEE_CSU 2.41 MiB