Printing the Microwave / IEEE Student Branch of Polytechnique Montréal
Part 1
Additive Manufacturing Techniques (3D Printing) for Microwave Devices and Systems
- Introducing three methodologies to 3D-print RF and microwave components:
- Fused Deposition Modeling (FDM)
- Binder Jetting technique
- Photo-polymerization
- Designing broadband interconnects such as SIW and SISW waveguides.
- Integrating 3D-printing techniques with microwave technologies (SIW and NRD) to create innovative components and systems suitable for the Internet of Things (IoT) and the 5G applications.
Part 2
IEEE Student Branch, University of Pavia, Italy
- IEEE: Institute of Electrical and Electronics Engineers
- IEEE Student Branch: Goals, Activities, Organization
- IEEE Student Branch, University of Pavia:
Members, Committees, Activities, Awards
Part 3
IEEE Student Branch, Polytechnique Montréal
- Mission & Vision
- Activities
- Volunteers
Date and Time
Location
Hosts
Registration
- Date: 12 Apr 2018
- Time: 12:45 PM to 01:45 PM
- All times are (GMT-05:00) Canada/Eastern
-
Add Event to Calendar
- Polytechnique Montréal
- Montreal, Quebec
- Canada
- Building: Pavillon Lassonde
- Room Number: M-2101
- Click here for Map
- Contact Event Host
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Event Organizer: Mihaela Talpos
IEEE Student Branch Chair: Melissa Vosough Tehrani
- Co-sponsored by IEEE Montreal
- Starts 03 April 2018 02:00 PM
- Ends 12 April 2018 01:45 PM
- All times are (GMT-05:00) Canada/Eastern
- No Admission Charge
Speakers
Enrico Massoni
Printing the Microwaves
IEEE Student Branch Chair, University of Pavia, Italy
Visiting researcher at Polytechnique Montréal, Poly-Grames
Biography:
Enrico Massoni was born in Broni, Italy, in 1991. He received the B.S. degree in Electronics and Telecommunications and the M.S. degree in Electronic Engineering from the University of Pavia, Pavia, Italy, in 2013 and 2015, respectively. He is currently working towards his Ph.D. degree within the Microwave Laboratory group of the Electrical, Computer and Biomedical Engineering Dept. at the University of Pavia. His research activities mainly deal with the design and implementation of new passive interconnects and components, mostly in substrate-integrated waveguide and non-radiative technology, via additive manufacturing techniques of novel 3D-printed materials for RF and microwaves systems. He received the first prize at the “Graduate Student Challenge” at IMS2014 in Tampa, FL, the first prize at the “Student Challenge” at the 46th European Microwave Conference in London, UK, in 2016, and the “Best Poster Award” at the IEEE Circuit and Systems Society CAS-day event in Como, Italy, in 2016. More recently, in the Fall 2017, he has been awarded with the first class italian scholarship "Isabella Sassi Bonadonna" ed. 2017 from Italian Engineering Association AEIT and with the IEEE MTT-S Fellowship for the 2018 ed. He has been the Chair of the IEEE Student Branch of Pavia (recipient of the "Exemplary Student Branch Award” – Italy Section – R8 – 2016 and 2017 editions and the "Regional" for the A.Y. 16/17) and the Founder and Chair of the MTT-S Student Branch Chapter of Pavia.
Mihaela Talpos
IEEE Student Branch of Polytechnique Montréal
Department of Electrical Engineering
Polytechnique Montreal
Biography:
I study Electrical Engineering at Polytechnique Montréal. Someone once told me “don’t let school get in the way of your education” and I think this is very relevant to the way the system is made. I am someone that is very focused on academics, so I try to remind myself to stay involved and in contact with other people because I believe we learn most from each other. This is the main reason why I decided to join the IEEE student branch. I love learning about new things and sharing experiences with others. My main interest right now is directed towards renewable energy, but I am open to discovering new interests. Other than school, I love traveling and one of my life goals is to see the world and live in many different places.