IEEE Solid State Circuit Distinguished Lecture - David Stoppa
Title: Time of Flight 3D Sensing and Imaging: detectors, readout circuits and data processing
In the past few years we have assisted to a tremendous increase of the number of applications requiring highly sophisticated electronic systems capable of taking autonomous decisions during the interaction with complex environments and scenarios.
Depth sensors represent a fundamental enabling technology for such applications, allowing to reconstruct a complete 3D model of the surrounding environment, thus increasing the reliability and robustness of automatic objects classification.
Several depth-sensing technologies are available, and it is becoming more and more evident that the optimal solution relies on a clever combination and optimization of multiple techniques, through a careful optimization at system level of a multitude of parameters.
The main goal of this talk is to provide an in-depth overview of state-of-the-art ToF detectors technologies focusing on the main advantages and disadvantages of the two key competing detector classes, i.e. photo-demodulators or SPADs, and their natural implementation in indirect-/direct-ToF systems through key examples from commercial and academic implementations.
Date and Time
- Date: 08 Nov 2018
- Time: 05:00 PM to 07:10 PM
- All times are Europe/Zurich
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- Gloriastrasse 35
- Zurich, Switzerland
- Switzerland 8092
- Building: ETZ E 81
- Room Number: E81
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The room is going to be ETZ E 81
- Co-sponsored by ETH Zürich Integrated Systems Laboratory
- Starts 12 October 2018 02:32 PM
- Ends 07 November 2018 02:32 PM
- All times are Europe/Zurich
- 6 spaces left!
- No Admission Charge
CMOS Sensors and Readout Circuits for Three-Dimensional Imaging
3D imaging has become a hot research topic in the last few years, driven by the needs of emerging markets looking for next-generation user interfaces based on gesture control. Moreover, 3D vision systems offer amazing possibilities of improvement in many other areas like self-driving cars, security and surveillance, cultural heritage preservation, ambient-assisted living, industrial control, etc., because they significantly increase the robustness of object classification with respect to conventional 2D imagers. This lecture will introduce participants to the exciting field of 3D imaging, providing an overview about image-sensor architectures capable of distance measurement. An introduction to existing 3D imaging technologies will be given, addressing the peculiarities of each measuring technique and the possible application domains. The focus is on solid-state sensor architectures as enabling technologies to improve the performance of 3D vision systems, with a particular emphasis on time-of- flight implementations. Finally, participants will get some practical tools such as figure of merits and experimental characterizations guidelines for a comprehensive comparison of 3D imager performance and a perspective toward the future challenges in this fast-evolving field.
David Stoppa (SM’12-M’97) received the Laurea degree in Electronics Engineering from Politecnico of Milan, Italy, in 1998, and the Ph.D. degree in Microelectronics from the University of Trento, Italy, in 2002. In 2017 he joined AMS where he is in charge of the research and development of next generation range-sensors. From 2014 to 2017 he has been the head of the Integrated Radiation and Image Sensors research unit at FBK where he has been working as a research scientist since 2002 and as group leader of the Smart Optical Sensors and Interfaces group from 2010 to 2013. From 2002 to 2012 he has been teaching at the Telecommunications Engineering faculty of the University of Trento, courses of Analogue Electronics and Microelectronics. His research interests are mainly in the field of CMOS integrated circuits design, image sensors and biosensors. He has authored or co-authored more than 120 papers in international journals and presentations at international conferences, and holds several patents in the field of image sensors. Since 2011 he served as program committee member of the ‘International Solid-State Circuits Conference’ (ISSCC) and the SPIE ‘Videometrics, Range Imaging and Applications’ conference, and was technical committee member of ‘International Image Sensors Workshop’ (IISW) in 2009, 2013, 2015 and 2017. He was a Guest Editor for IEEE Journal of Solid-State Circuits special issues on ISSCC’14 in 2015 and he is serving as Associate Editor since 2017. Dr. Stoppa received the 2006 European Solid-State Circuits Conference Best Paper Award.
The seminar will be held with the following agenda :
We have a formal part
17:00 - 18:30 : Lecture + Q&A + Demo
And an informal part
18:30 - 19:00 : Apéro & Snacks