Madison IEEE June ECN: Packaging SoCs

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Talk: Inexpensive System-On-a-Chip devices have radically changed the application of digital processing to common problems. The Raspberry Pi has now become the third most prevalent general purpose computer (after the PC and Apple devices) in the world. It can also be used to implement instruments and serve as a system integration device. Several packaging and powering options will be shown including, wall-warts, SoC Blades, Power-Over-Ethernet (PoE), Fake PoE and battery powered options.  Bring your preferred solutions to the discussion.



  Date and Time

  Location

  Hosts

  Registration



  • 56 Cory Street
  • Madison, Wisconsin
  • United States 53704
  • Building: Sector67
  • Room Number: Conference Room
  • If needed, call Tom Kaminski 2 1 7 3 3 2 7

  • Starts 09 June 2019 12:09 PM
  • Ends 20 June 2019 08:00 AM
  • All times are America/Chicago
  • No Admission Charge
  • Register


  Speakers

Tom Kaminski

Tom Kaminski

Topic:

SoCs Packaging for Portable Systems and Audio Use

Biography:

Tom Kaminski is a retired instructor of Automation from Madison College. He has been working on using SoCs to solve system integration problems for years and has several products using SoCs under development, including a Sonic Boom recorder for use by NASA, a Community Noise Monitor, and a Light-Rail Ride Quality device.

Email:





Agenda

Short introductions

Lunch (Bring your own)

Speaker Demos

Open Discussion