Madison IEEE June ECN: Packaging SoCs
Talk: Inexpensive System-On-a-Chip devices have radically changed the application of digital processing to common problems. The Raspberry Pi has now become the third most prevalent general purpose computer (after the PC and Apple devices) in the world. It can also be used to implement instruments and serve as a system integration device. Several packaging and powering options will be shown including, wall-warts, SoC Blades, Power-Over-Ethernet (PoE), Fake PoE and battery powered options. Bring your preferred solutions to the discussion.
Date and Time
Location
Hosts
Registration
- Date: 20 Jun 2019
- Time: 11:30 AM to 01:00 PM
- All times are (UTC-05:00) Central Time (US & Canada)
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- 56 Cory Street
- Madison, Wisconsin
- United States 53704
- Building: Sector67
- Room Number: Conference Room
- Contact Event Host
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If needed, call Tom Kaminski 2 1 7 3 3 2 7
- Starts 09 June 2019 12:09 PM
- Ends 20 June 2019 08:00 AM
- All times are (UTC-05:00) Central Time (US & Canada)
- No Admission Charge
Speakers
Tom Kaminski
SoCs Packaging for Portable Systems and Audio Use
Biography:
Tom Kaminski is a retired instructor of Automation from Madison College. He has been working on using SoCs to solve system integration problems for years and has several products using SoCs under development, including a Sonic Boom recorder for use by NASA, a Community Noise Monitor, and a Light-Rail Ride Quality device.
Email:
Agenda
Short introductions
Lunch (Bring your own)
Speaker Demos
Open Discussion