Fundamentals and Recent Advances in Power Integrity

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Although signal and power integrity practices are as old as the digital design itself, unlike SI, PI still remains an elusive concept in the eyes of industrial circles. One reason is the cause-and-effect relation in PI analysis hasn’t been firmly established in practical applications. For example, with SI analysis, a logic failure can be traced to a noise threshold violation. PI analysis, on the other hand, hardly points out to a smoking gun with the same rigor. Starting from a qualitative and descriptive introduction of power noise fundamentals, the current analysis techniques for printed circuit structures will be reviewed and their limitations will be discussed with practical workarounds. Some recent developments including a novel interpretation of the effective radius of a decoupling capacitor and multipin optimization of capacitors will be presented on sample cases.



  Date and Time

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  • EPFL
  • Lausanne, Switzerland
  • Switzerland 1015
  • Building: ELL
  • Room Number: 116
  • Click here for Map
  • Co-sponsored by EMC Laboratory - EPFL


  Speakers

Dr. Ihsan Erdin
Dr. Ihsan Erdin of Celestica, Carleton University

Topic:

Power Integrity

Biography:

Ihsan Erdin received the M. Sc. degree from Middle East Tech. U, Ankara, Turkey in 1993 and the Ph.D. degree from Carleton University in 2001, both in electrical engineering. From 1995 to 1996, he was a research fellow at Defense Research Development (DRDC) Ottawa. From 2000 to 2007, he worked as an SI/PI engineer at Nortel. Since 2007, he has been working in the same job function at Celestica Engineering Design Services in Ottawa. He is an adjunct faculty member at the Electronics Department of Carleton University since 2007. Dr. Erdin is a member of the Professional Engineers Ontario and a senior member of IEEE. He also serves as a member of Signal and Power Integrity Technical Committee (TC-10) of EMC Society.  He has published over 40 technical papers in peer-refereed journals and conference proceedings with a focus on electromagnetic analysis methods of printed circuits and multichip modules.

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