Advances in Thermal Management with Epoxy Systems
Sponsor: IEEE Boston/Providence/New Hampshire Reliability Chapter
Please visit our website at www.ieee.org/bostonrel
Host: MIT Lincoln Laboratory
Epoxy Technology has investigated the mechanism of thermal conductivity in electrically conductive adhesives. Utilizing laser flash testing and SEM cross sections, we determined how silver flake distribution effects thermal conductivity. Cure, interface, and processing play a significant role in thermal management. This reviews a new laser flash sample preparation methodology that provides more accurate measurement of “in-design” thermal resistance.
Date and Time
Location
Hosts
Registration
- Date: 21 Jan 2020
- Time: 10:30 PM UTC to 12:30 AM UTC
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- MIT Lincoln Laboratory
- 3 Forbes Rd.
- Lexington, Massachusetts
- United States 02421
- Contact Event Host
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Michael W. Bannan, Chair
Boston/Providence/New Hampshire Reliability Chapter
- Starts 26 December 2019 05:00 PM UTC
- Ends 20 January 2020 10:30 PM UTC
- No Admission Charge
Speakers
Brian Bruce of Epoxy Technology, Inc.
Advances in Thermal Management with Epoxy Systems
Epoxy Technology has investigated the mechanism of thermal conductivity in electrically conductive adhesives. Utilizing laser flash testing and SEM cross sections, we determined how silver flake distribution effects thermal conductivity. Cure, interface, and processing play a significant role in thermal management. This reviews a new laser flash sample preparation methodology that provides more accurate measurement of “in-design” thermal resistance.
Biography:
Brian Bruce is the Manager, Applications Engineering Lab with over 9 years of specialized training and experience in epoxy and UV adhesive applications. He has supported numerous Fortune 500 companies in their manufacturing assembly and bonding needs. He holds a Bachelor’s Degree in Chemistry from Wheaton College, and currently is employed by Epoxy Technology Inc.
Address: Epoxy Technology, Inc., 14 Fortune Dr., Billerica, Massachusetts, United States, 01821
Agenda
5:30PM Networking
5:45PM Light dinner - pizza, salad and beverages
6:00PM Opening and Announcements
6:20PM – 7:30PM Technical Presentation and Q&A
The meeting is open to all. You do not need to belong to the IEEE to attend this event; however, we welcome your consideration of IEEE membership as a career enhancing technical affiliation.
Free pizza, salad, desserts, and beverages will be available.
There is no cost to register or attend, but registration is required.