TIE 2020 (THE INTERCONNECTION TECHNIQUES IN ELECTRONICS) - THE SPRING CONVENTION OF ELECTRONIC PACKAGING COMMUNITY THE 29th EDITION & INTERNATIONAL PROFESSIONAL STUDENT CONTEST

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The INTERCONNECTION TECHNIQUES IN ELECTRONICS (TIE) contest is THE SPRING CONVENTION OF ELECTRONICS PACKAGING COMMUNITY and a high-tech student professional contest whose objective is to promote technological computer-aided design (CAE-CAD-CAM) of printed circuit boards and electronic modules. 


The TIE contest brings together students from different Universities since 1992. Students have a great opportunity by taking part in this contest. A good organization and total transparency during the contest are the main coordinates proving professionalism and fair-play among students keen on electronics packaging.

Being in close relations with the industry, TIE contestants are widely sought by highly appraised companies for internships and hiring after graduating from their studies. As a result, many examples of past TIE contestants can be found in high ranking functions at important companies around the country and around the world, often returning to TIE as part of the “Industrial Committee”.

TIE not only aims to bring industry and university together, in a tighter, more constant collaboration but under its slogan, „Turn your hobby into profession!”, also targets to challenge students to think outside of the box, to face them with real-life design challenges and present to them what are the industry’s expectations from an engineering graduate. Therefore, besides the student contest, workshops and presentations held by both foreign universities, as well as electronics companies, go along with the contest every year.



  Date and Time

  Location

  Contact

  Registration



  • Bucharest, Ilfov
  • Romania
  • Building: Central Library of UPB

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  • Co-sponsored by Continental Automotive Timisoara
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