TIE 2020 (THE INTERCONNECTION TECHNIQUES IN ELECTRONICS) - THE SPRING CONVENTION OF ELECTRONIC PACKAGING COMMUNITY THE 29th EDITION & INTERNATIONAL PROFESSIONAL STUDENT CONTEST
The INTERCONNECTION TECHNIQUES IN ELECTRONICS (TIE) contest is THE SPRING CONVENTION OF ELECTRONICS PACKAGING COMMUNITY and a high-tech student professional contest whose objective is to promote technological computer-aided design (CAE-CAD-CAM) of printed circuit boards and electronic modules.
The TIE contest brings together students from different Universities since 1992. Students have a great opportunity by taking part in this contest. A good organization and total transparency during the contest are the main coordinates proving professionalism and fair-play among students keen on electronics packaging.
Being in close relations with the industry, TIE contestants are widely sought by highly appraised companies for internships and hiring after graduating from their studies. As a result, many examples of past TIE contestants can be found in high ranking functions at important companies around the country and around the world, often returning to TIE as part of the “Industrial Committee”.
Date and Time
- Start time: 01 Apr 2020 12:00 PM
- End time: 04 Apr 2020 12:00 PM
- All times are Europe/Bucharest
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- Co-sponsored by Continental Automotive Timisoara
- Survey: Fill out the survey