2020 ACM/IEEE International Workshop on System-Level Interconnect Problems and Pathfinding (SLIP^2)

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SLIP^2, co-located with ICCAD 2020, will bring together researchers and practitioners who have a shared interest in the challenges and futures of system-level interconnect, coming from wide-ranging backgrounds that span system, application, design and technology.

The 2020 ACM/IEEE International Workshop on System-Level Interconnect Problems and Pathfinding (SLIP^2) is the 22nd, "rebooted" edition of the System-Level Interconnect Prediction (SLIP) Workshop. As computing systems and applications grapple with a post-Moore, post-CMOS, post-von Neumann future, fundamental interconnect problems and pathfinding challenges have become more critical to address than ever before.


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  • Date: 05 Nov 2020
  • Time: 08:00 AM to 08:00 PM
  • All times are (UTC-08:00) Pacific Time (US & Canada)
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Agenda

TECHNICAL TOPICS

Technical topics include but are not limited to:

  • Learning and predictive models for interconnect at various IC and system design stages

  • Roadmapping and pathfinding of interconnect technology and architectures

  • Roadmapping and pathfinding of chip-to-chip interconnect, chiplets, and chip-package interfaces

  • System-level design for FPGAs, NoCs, reconfigurable systems

  • 2.5D and 3D-integrated system interconnect optimization, projection and pathfinding

  • Design, analysis, and (co)optimization of power and clock distribution networks

  • Topologies and fabrics of multi- and many-core architectures

  • Predictive models for power and performance of system-level interconnects

  • Interconnects in social, genetic, and biological systems

  • Interconnects in complex networks and high-performance computing

  • Interconnects in quantum architectures

  • System-level interconnect reliability, aging, thermal, yield and cost issues

  • Bio-inspired connectionist systems, such as artificial neural networks