2020 ACM/IEEE International Workshop on System-Level Interconnect Problems and Pathfinding (SLIP^2)


SLIP^2, co-located with ICCAD 2020, will bring together researchers and practitioners who have a shared interest in the challenges and futures of system-level interconnect, coming from wide-ranging backgrounds that span system, application, design and technology.

The 2020 ACM/IEEE International Workshop on System-Level Interconnect Problems and Pathfinding (SLIP^2) is the 22nd, "rebooted" edition of the System-Level Interconnect Prediction (SLIP) Workshop. As computing systems and applications grapple with a post-Moore, post-CMOS, post-von Neumann future, fundamental interconnect problems and pathfinding challenges have become more critical to address than ever before.

  Date and Time




The SLIP^2 workshop will be co-located with the 2020 International Conference On Computer Aided Design (ICCAD), November 2-5, 2020.

In view of the current COVID-19 pandemic around the world, ICCAD 2020 will host this year's event online/virtual.
SLIP^2 workshop, being part of the ICCAD program, will therefore be held virtually, as well.

  • San Diego
  • United States

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Technical topics include but are not limited to:

  • Learning and predictive models for interconnect at various IC and system design stages
  • Roadmapping and pathfinding of interconnect technology and architectures
  • Roadmapping and pathfinding of chip-to-chip interconnect, chiplets, and chip-package interfaces
  • System-level design for FPGAs, NoCs, reconfigurable systems
  • 2.5D and 3D-integrated system interconnect optimization, projection and pathfinding
  • Design, analysis, and (co)optimization of power and clock distribution networks
  • Topologies and fabrics of multi- and many-core architectures
  • Predictive models for power and performance of system-level interconnects
  • Interconnects in social, genetic, and biological systems
  • Interconnects in complex networks and high-performance computing
  • Interconnects in quantum architectures
  • System-level interconnect reliability, aging, thermal, yield and cost issues

  • Bio-inspired connectionist systems, such as artificial neural networks