Thermal Design Decision Making, Using Test & Simulation
Have you experienced delays or re-spins from discovering thermal issues late stage? Or faced challenges in developing accurate simulation models to make an important decision? Or simply struggled with finding thermal data to use in simulation studies? Please join this upcoming in-depth online seminar, for engineers who are seeking to improve their processes and develop robust thermal management solutions faster. Please register for our complimentary 1.5 hour educational online seminar combining thermal design process insight and exploration of how test and simulation tools are applied, presented by subject matter experts from Laird Performance Materials and Siemens Digital Industries Software. The session offers a unique insight through a worked power electronics example on the process of evaluating device and package thermal properties; thermal interface material decision making, right through to achieving highest order accuracy for a package thermal model within a 3D electronics cooling system level simulation. You will learn methods common to any application on predicting temperature with higher fidelity, and earlier, with confidence so you can achieve thermal design goals. Key topics - Emerging thermal challenges in electronics applications - Thermal Interface Material design considerations - How to perform thermal transient testing (using Simcenter T3STER technology) - Comparing thermal interface materials’ thermal properties - Package thermal characterization and detailed thermal model calibration - 3D electronics cooling simulation studies vs design stage (using Simcenter Flotherm)
Please register here: https://register.gotowebinar.com/register/8335576180057344523?source=McMaster+IEEE
Date and Time
Location
Hosts
Registration
- Date: 15 Oct 2020
- Time: 12:00 PM to 01:45 PM
- All times are (GMT-05:00) Canada/Eastern
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- Starts 19 September 2020 11:32 AM
- Ends 15 October 2020 11:00 AM
- All times are (GMT-05:00) Canada/Eastern
- No Admission Charge