Design & Materials Challenges For Cost-Effective High-Performance LEDs

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-- solid state lighting, design, materials, processes, challenges, innovative approaches ...


The rapid development of solid state lighting applications is driving the need for innovative approaches in LED packaging. While the majority of high-power emitters are still using conventional packaging methods, there are next-generation LED technologies and applications that requires integration of existing approaches with IC packaging knowhow. The LED industry is also driving low-cost solutions to the design, materials and processes in order to be market-competitive due to the emergence of LED suppliers in Asia, particularly in China. This talk will discuss the challenges in the LED integration structure from die to package, package to board and system, focusing in identifying challenges that need to be overcome in optical design, materials, and manufacturing processes. Comparison of similarities and opportunities in both LED and IC packaging will be discussed.



  Date and Time

  Location

  Hosts

  Registration



  • Date: 15 Oct 2020
  • Time: 11:40 AM to 01:00 PM
  • All times are (GMT-08:00) US/Pacific
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Directions for connecting with the stream will be sent via email to all registrants 1-2 days prior to the event.

  • Santa Clara, California
  • United States

  • Directions for connecting with the stream will be sent via email to all registrants 1-2 days prior to the event.

  • Starts 24 September 2020 09:40 PM
  • Ends 15 October 2020 12:30 PM
  • All times are (GMT-08:00) US/Pacific
  • No Admission Charge


  Speakers

TY Hin TY Hin of Lumileds

Biography:

DR Tze Yang Hin has 20 years of packaging development experience. He is currently managing LED packaging development activities atLUMILEDS. He has authored and co-authored over 20 technical papers and patent filings in the area of electronics packaging. His current research interest is next-generation mini/micro LED packaging and low-cost packaging innovation.