Technical Talk on Advanced Substrate and PCB for High Frequency and High Speed Applications

#PCB #Substrate #RF #Microwave #High #Frequency #High-speed #Circuit #5G
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MTT-S Tainan Chapter Technical Speech

1.Introduction to Unimicron

2.Advanced Substrates and PCBs

lTechnology roadmap

3.Key Technologies and Challenges

4.Thermal Management

5.Summary


  Date and Time

  Location

  Hosts

  Registration


  • Date: 30 Oct 2020
  • Time: 05:30 AM UTC to 08:00 AM UTC
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  • Co-sponsored by Department of Electrical Engineering, Department of Communications Engineering, Advanced institute of manufacturing with high-tech innovations (aim-hi), Center for Telcommunication Research, National Chung Cheng University

  Speakers

Dr. WANG, JIN-SHENG of Unimicron Technology Corp.

Topic:

Advanced Substrate and PCB for High Frequency and High Speed Applications

Biography:

1987~1992 台大化工博士

1985~1987 台大化工碩士

1981~1985 中央化工學士

2019~now 欣興電子資深特助

2016~2019 欣興電子資深副總

2000~2016 旭德科技資深副總

1997~2000 群策電子(欣興)經理

1992~1997 工研院量測中心工程師

Email:

Address:桃園市龜山區山鶯路179號興欣電子, , 桃園市桃園區, Taiwan, 333




Agenda

30 Oct 2020 01:30 PM ~ 30 Oct 2020 01:30 PM Academic Speech & Discussion


IEEE MTT-S TainanChapter, Department of Electrical Engineering, Department of Communications Engineering, Advanced institute of manufacturing with high-tech innovations (aim-hi), Center for Telcommunication Research, National Chung Cheng University

國立中正大學通訊工程系、國立中正大學電機工程系、國立中正大學電信研究中心、前瞻製造系統頂尖研究中心


  Media

Thanks for Dr. Wang Presenter : Dr.Wang (Unimicron) 1.28 MiB
During Lecture 1.27 MiB
Asking qestion 220.91 KiB
Technology Roadmap of Unimicron 247.61 KiB
Lab Tour 238.74 KiB