SWISS IEEE EPS EVENT (WEBINAR)- High Thermal Conductivity Materials towards Efficient Thermal Management of Electronic Devices : Application and Modelling

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As miniaturization trend  for semiconductor chips continues, power density is increasing rapidly. So it has become very important, especially for high power semiconductors or high power lasers to remove the heat away from the chip efficiently and rapidly, to ensure a long life time for the chips. This webinar will focus on usage of high thermal conductivity materials as die attach and substrate materials for efficient heat removal.

Agenda:

16:00 - 16:05 : Welcome and Introduction

16:05 - 16:30 : "Advanced Thermal Management Solutions based on Diamond Composites", Dr. Erich Neubauer, Managing Director, RHP technology GmbH, Austria

16:30 - 16:55 : "Improving the Thermal Performance Through Silver Sintering in Power Electronics", Michiel de Monchy, Applications manager die attach and preforms Europe, Macdermid Alpha Assembly Solutions, The Netherlands

16:55 - 17:20 : "FEM modeling and experimental validation for advanced packaging and thermal management", Guido Spinola Durante,  Expert, CSEM SA, Switzerland

17:20 - 17:30 : General discussions and closure 

 

Please Join at 16:00 [CET], please mute your microphone.



  Date and Time

  Location

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  Registration



  • Date: 30 Sep 2021
  • Time: 04:00 PM to 05:30 PM
  • All times are Europe/Zurich
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  • Starts 19 July 2021 09:00 PM
  • Ends 29 September 2021 09:00 PM
  • All times are Europe/Zurich
  • No Admission Charge