Advanced Packaging in Hyperscale Data Center Applications
Advanced Packaging technologies including Silicon and Silicon photonics are key enablers for scaling Hyperscale Data Center. This talk will discuss the roadmap of technology building blocks with a focus on increasing in performance while reducing power per Gbps. Challenges toward device integration, reliability and industry eco-system collaboration will also be elaborated.
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- Date: 06 May 2022
- Time: 05:00 PM UTC to 06:00 PM UTC
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- Starts 01 April 2022 04:20 PM UTC
- Ends 06 May 2022 04:20 PM UTC
- No Admission Charge
Speakers
Dr Jie Xue
Advanced Packaging in Hyperscale Data Center Applications
Advanced Packaging technologies including Silicon and Silicon photonics are key enablers for scaling Hyperscale Data Center. This talk will discuss the roadmap of technology building blocks with a focus on increasing in performance while reducing power per Gbps. Challenges toward device integration, reliability and industry eco-system collaboration will also be elaborated.
Biography:
Jie Xue leads Cisco’s Technology and Quality organization, a global team responsible for pathfinding, developing, and executing technology innovations to enable all Cisco networking product portolio. Jie oversees development of leading edge technologies for Si-Photonics, Advanced Si, ASICs, PCBs, Optics, memory, and complex interconnect technologies. Prior to joining Cisco, Jie held several management and engineering positions at Motorola, Inc., working on R&D and product development.
Jie is an IEEE Fellow, President of IEEE – Electronics Packaging Society (EPS) 2014-2015. She has published more than 90 technical papers, holds 15 patents. Jie holds a Bachelor of Science from Tsinghua University in Beijing, China and a Master of Science and PhD from Cornell University.