Electrical Design of Advanced Packaging in Computing Systems

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The electrical design of computer systems, which is often called signal integrity and power integrity, is a cross-discipline engineering effort essential to reliable operation of complex systems. This presentation will cover the development of electrical techniques, tools, and methodologies as applied to the design of systems.  These concepts have become the fundamentals on which today’s electrical design methodologies are built. Currently, heterogeneous integration driving the advancement of systems and increased integration of special processor cores and accelerators has created a challenge as well as a great opportunity for the electrical packaging engineer. Advancing the existing design practices to include co-design of chips and packages, multi-physics analysis with thermal-electrical analysis is a current focus of academic and industry development to achieve a higher level of integration.



  Date and Time

  Location

  Hosts

  Registration



  • Date: 15 Jun 2022
  • Time: 12:00 PM to 01:00 PM
  • All times are (UTC-05:00) Eastern Time (US & Canada)
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  • Binghamton University
  • 85 Murray Hill Road
  • Vestal , New York
  • United States 13850
  • Building: Smart Energy Building
  • Room Number: Fountain Room, Smart Energy

  • Co-sponsored by Binghamton University IEEC


  Speakers

Dr Dale Becker

Topic:

Electrical Design of Advanced Packaging in Computing Systems

The electrical design of computer systems, which is often called signal integrity and power integrity, is a cross-discipline engineering effort essential to reliable operation of complex systems. This presentation will cover the development of electrical techniques, tools, and methodologies as applied to the design of systems.  These concepts have become the fundamentals on which today’s electrical design methodologies are built. Currently, heterogeneous integration driving the advancement of systems and increased integration of special processor cores and accelerators has created a challenge as well as a great opportunity for the electrical packaging engineer. Advancing the existing design practices to include co-design of chips and packages, multi-physics analysis with thermal-electrical analysis is a current focus of academic and industry development to achieve a higher level of integration.

Biography:

Dale Becker is a Chief Engineer of Electronic Packaging Integration in IBM Systems, Poughkeepsie, NY. He is responsible for system packaging architecture of IBM Power Systems and System Z including the design of high-speed channels to enable the computer system performance and the power distribution networks. He has chaired the IEEE EPS Technical Committee on Electrical Modeling, Design, and Simulation and was a Senior Area Editor for the Transactions on CPMT. Dale co-chairs the HIR High-Performance Computing & Data Center Technical Working Group. He is a Technical Committee member for iNEMI. He has been elected an IEEE Fellow.





-- signal integrity, power integrity, methodologies, tools, heterogeneous integration, cores, accelerators, packaging issues ...