In-situ Monitoring of Thermo-mechanical Induced Stress in ASICs and Electronic Control Units for Automotive

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Current development in automotive electronics is driven by four major trends: Connectivity, Automation, Sharing and Electrification, or CASE. To fulfill the expectation of society, electronic components and systems are becoming more complex with a significant increase in functionality. All these trends create new technical challenges, such as new use-case conditions, extended usage due to driving and charging, transferring consumer-based technologies into an automotive harsh environment, etc. These challenges are consequently solved during the design and development phase of novel electronics products using the physics of failure reliability approach supported by simulations. The typical reliability approach is divided into the component-, board- and system level. Numerical simulations are used in a similar multi-stage fashion, transferring the information about loading conditions to specific testing scenarios. To fully rely on the simulation, validation of the numerical model is an important step. In this webinar, I will present an application of the piezoresistive stress sensor to monitor the stress state during different stages of reliability assessment, from component to ECU level.



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  • Date: 21 Jul 2022
  • Time: 08:00 AM to 09:00 AM
  • All times are (UTC-08:00) Pacific Time (US & Canada)
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  Speakers

Przemyslaw Gromala of Robert Bosch GmbH

Topic:

In-situ Monitoring of Thermo-mechanical Induced Stress in ASICs and Electronic Control Units

Current development in automotive electronics is driven by four major trends: Connectivity, Automation, Sharing and Electrification, or CASE. To fulfill the expectation of society, electronic components and systems are becoming more complex with a significant increase in functionality. All these trends create new technical challenges, such as new use-case conditions, extended usage due to driving and charging, transferring consumer-based technologies into an automotive harsh environment, etc. These challenges are consequently solved during the design and development phase of novel electronics products using the physics of failure reliability approach supported by simulations.
The typical reliability approach is divided into the component-, board- and system level. Numerical simulations are used in a similar multi-stage fashion, transferring the information about loading conditions to specific testing scenarios. To fully rely on the simulation, validation of the numerical model is an important step. In this webinar, I will present an application of the piezoresistive stress sensor to monitor the stress state during different stages of reliability assessment, from component to ECU level.

Biography:

Przemyslaw Gromala is a simulation senior expert and simulation team leader at Robert Bosch GmbH, Automotive Electronics in Reutlingen, Germany. His research activities focus on the implementation of the simulation-driven design for electronic control modules and multi-chip power packaging. His technical expertise includes Virtual DoE, material characterization, physics of failure simulation, validation, and verification techniques, and prognostics and health management. Prior to joining Bosch Mr. Gromala worked at Delphi in Krakow, as well as at Infineon in Dresden. He holds a Ph.D. in mechanical engineering from the Cracow University of Technology in Poland. He is chair of the IEEE EPS Technical Committee on Reliability, and ASME’s InterPACK 2022 general chair.

Address:Germany





Agenda

— automotive electronics, harsh environment, stress sensor, design, functionality, use cases, simulations, validation …