Mini Colloquium on Advanced Technology for Inter-Chiplet Connectivity

#chiplets #packaging #heterogeneous #integration #materials

Various speakers will give talks on advanced technologies for inter-chiplet connectivity

  Date and Time




  • Date: 11 Aug 2022
  • Time: 08:15 AM to 12:30 PM
  • All times are (UTC-05:00) Eastern Time (US & Canada)
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  • 255 Fuller Rd
  • Albany, New York
  • United States 12203-3603
  • Building: NFS auditorium

  • Contact Event Host
  • Starts 26 July 2022 03:30 PM
  • Ends 11 August 2022 12:40 PM
  • All times are (UTC-05:00) Eastern Time (US & Canada)
  • No Admission Charge


Various speakers

Please see the agenda for details.


Vineet Pancholi, Sr Director, Test Technology, Amkor Technology, Inc., Topic: Advanced Technologies for Inter- Chiplet Connectivity 

Dr. Ning-Cheng Lee , ShinePure Hi-Tech, Topic: Material Considerations for high Reliability Pb-Free Solder Joints 

Dr. Tanja Braun, Fraunhofer IZM, Dept. System Integration and Interconnection Technologies, Topic: Advanced Packaging – Key for Heterogeneous Integration

Dr. Junghyun Cho, Professor, SUNY Binghamton, Topic: Bonding Technologies toward Ultra Fine Pitch 3D Interconnection