Mini Colloquium on Advanced Technology for Inter-Chiplet Connectivity
#chiplets
#packaging
#heterogeneous
#integration
#materials
Various speakers will give talks on advanced technologies for inter-chiplet connectivity
Date and Time
Location
Hosts
Registration
- Date: 11 Aug 2022
- Time: 08:15 AM to 12:30 PM
- All times are (UTC-04:00) Eastern Time (US & Canada)
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- 255 Fuller Rd
- Albany, New York
- United States 12203-3603
- Building: NFS auditorium
- Starts 26 July 2022 03:30 PM
- Ends 11 August 2022 12:40 PM
- All times are (UTC-04:00) Eastern Time (US & Canada)
- No Admission Charge
Speakers
Various speakers
Please see the agenda for details.
Agenda
Vineet Pancholi, Sr Director, Test Technology, Amkor Technology, Inc., Topic: Advanced Technologies for Inter- Chiplet Connectivity
Dr. Ning-Cheng Lee , ShinePure Hi-Tech, Topic: Material Considerations for high Reliability Pb-Free Solder Joints
Dr. Tanja Braun, Fraunhofer IZM, Dept. System Integration and Interconnection Technologies, Topic: Advanced Packaging – Key for Heterogeneous Integration
Dr. Junghyun Cho, Professor, SUNY Binghamton, Topic: Bonding Technologies toward Ultra Fine Pitch 3D Interconnection