Free Webinar IEEE IRDS Outside System Connectivity Roadmap

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Presentation of the 2022 edition of the Outside System Connectivity Chapter of the International Roadmap for Devices and Systems (IEEE IRDS):

The purpose of the Outside System Connectivity roadmap is to identify communication requirements for systems in
different applications, identify gaps in capabilities, critical component and device development needs for the next 15
years and monitor developments of capabilities to fill these future gaps. The Internet of Everything (IoE) is
continuing to expand in applications that demand higher volumes of higher performance communication. The IoE
includes a wide range of Internet of Things (IoT) devices communicating with cloud or edge computing that store
and process data and which was analyzed with applications and actions communicated. Most applications will
employ RF/microwave wireless communication to connect to the internet which will then connect through high-
performance backhaul or fiber optical interconnects to a cloud data center. Applications that required fast
communication and decision making, such as autonomous vehicles and traffic control, are developing high speed
networks in vehicle and adopting edge computing. Higher speed networks are needed to communicate with low
latency to edge processors and within edge and cloud data/processing centers. Higher data rate RF and photonic
components are needed that operate with ever increasing energy efficiency. Applications and future needs will be
discussed in this presentation


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  • Date: 06 Oct 2022
  • Time: 03:00 PM UTC to 04:00 PM UTC
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  • Co-sponsored by IEEE IRDS, SINANO Institute
  • Starts 31 August 2022 06:50 AM UTC
  • Ends 06 October 2022 03:00 PM UTC
  • No Admission Charge

  Speakers

Michael Garner of Garner Nanotechnology Solutions

Topic:

Connectivity Roadmap

The purpose of the Outside System Connectivity roadmap is to identify communication requirements for systems in
different applications, identify gaps in capabilities, critical component and device development needs for the next 15
years and monitor developments of capabilities to fill these future gaps. Applications and future needs will be
discussed in this presentation

Biography:

Michael Garner received his PhD in Materials Science & Engineering from Stanford
University in 1978. He joined Sandia National Labs as a Process Engineer & Product
Engineer. In 1983, he joined Intel’s Technology and Manufacturing Group, where he
was a Manager in Components Research and worked in several other roles in his 27 years
at Intel. Since 2004, he lead the Emerging Research Materials (ERM) Work Group of the
ITRS. Since retiring from Intel in January, 2011, he continued as the Co-Chair of the
ITRS ERM until 2015 and then as chair of the Outside System Connectivity WG of the
IEEE International Roadmap for Device and Systems. He also was a Visiting Scholar
from 2011 to 2013 and then a Consulting Professor until 2016 in Electrical Engineering
at Stanford University. He continues to consult with companies on emerging materials,
processes, and trends in information processing and communication.




IEEE EDS France & IRDS and the SINANO Institute organize a Webinar of another IRDS Chapter devoted this time to Outside System Connectivity, which will be presented by the IRDS IFT Leader Michael Garner