Millimeter Wave Integration and Packaging Strategies using Antenna-in-Package

#millimeter #-wave # #antenna #packaging #WIE
Share

Washington/Northern VA MTT-S Chapter Meeting


Millimeter Wave Integration and Packaging Strategies
using Antenna-in-Package 

Prof. Rashaunda Henderson

2022 President of the IEEE Microwave Theory and Technology Society

ECE Department, University of Texas at Dallas
Richardson, TX 75080

Wednesday Nov 2 2022

Affordable and high performance front end modules (FEMs) have been identified as key research challenges for millimeter wave communications. While the design of active components and sub-systems has been explored by many research groups, there is still a need to provide integration and packaging strategies that can meet system requirements and not inhibit the performance obtained at the wafer level. Antenna in package (AiP) is a key technique enabling the realization of future millimeter wave FEMs.

This presentation highlights the design, modeling, and characterization of planar antennas integrated into enhanced quad flat no-lead (eQFN) packages in WR8 (90GHz-140GHz) and WR5 (140GHz-220GHz) frequency bands. Further, the design, modeling, and simulation results of chip-to-package transitions, transmission line structures, and antenna feed elements are provided. The simulated bandwidth and gain of the integrated antennas is compared with their standalone versions. A description of the designed test vehicles and measurement methodology for antenna bandwidth, and radiation pattern characterization in the WR5 frequency band is also presented. To facilitate accurate design of the antennas and packaging transitions, high frequency material characterization is needed.  This work will include results on the dielectric  properties of the packaging substrates and overmold materials utilized in the frequency ranges mentioned.

Biography:

Rashaunda M. Henderson (S’91-M’99-SM’06) received the BSEE degree from Tuskegee University, Tuskegee AL in 1992, graduating with highest honors. She received the MS and PhD degrees in electrical engineering from The University of Michigan, Ann Arbor, MI, in 1994 and 1999, respectively.  Upon graduation, she joined Motorola Semiconductor Product Sector in Tempe, AZ and worked as a research and development device engineer in the microwave and mixed-signal technology labs for wireless embedded systems.  She joined The University of Texas at Dallas in 2007 as an Assistant Professor in the Erik Jonsson School of Engineering and Computer Science. She is now a Professor in the Electrical and Computer Engineering Department and Interim co-Department Head. Dr. Henderson is co-founder of the High Frequency Circuits and Systems Laboratory, which facilitates millimeter-wave design and development of components, circuits and integrated packages and antennas for wireless communication systems. She has authored/co-authored more than 100 journal and conference papers/presentations in the field of microwave circuits and electronic packaging for high frequency applications. Dr. Henderson is a Senior Member of the IEEE and the 2022 President of the IEEE Microwave Theory and Technology Society (MTT-S) Administrative Committee. She is passionate about educating the next generation student and encouraging them to seek careers in science, technology, engineering and mathematics.



  Date and Time

  Location

  Hosts

  Registration



  • Date: 02 Nov 2022
  • Time: 06:30 PM to 09:00 PM
  • All times are (UTC-04:00) Eastern Time (US & Canada)
  • Add_To_Calendar_icon Add Event to Calendar
  • Maggiano's Little Italy
  • 2001 International Drive
  • McLean, Virginia
  • United States 22102
  • Building: Tysons Galleria Mall
  • Room Number: Level 2, near Nieman Marcus

  • Contact Event Hosts
  • Starts 19 October 2022 12:00 PM
  • Ends 01 November 2022 09:00 PM
  • All times are (UTC-04:00) Eastern Time (US & Canada)
  • 0 in-person spaces left!
  • No Admission Charge






Agenda

Dinner 6:30-7:30 pm

Lecture 7:30-9:00 pm

You are cordially invited to our first post-pandemic IEEE MTT technical dinner-meeting.  
Free dinner for all attendees will be provided.
Please register to attend. Advance registration is required.  Capacity is limited.
If after registering you find that you cannot attend, please email ikossi@ieee.org



Sponsored by the IEEE MTT-S Washington/Northern VA Chapter
Co-sponsored by the IEEE Women in Engineering Northern VA Chapter