Xuejun Fan

-- stress conditions, thermo-mechanical, vibrational, moisture, humidity, electromigration, acceleration factors, applications ...

This course presents an overview of the physics of failures in electronics packaging. The course discusses key fundamental concepts of reliability physics associated with various stress conditions, including thermal degradation, thermo-mechanical stress, dynamic and vibrational loading, moisture and humidity, as well as electrical current stress. Failure mechanisms studied include chip-package interactions, micro-bump reliability, electromigration performance, inter-layer dielectric (ILD) damage under bumps and Cu pillars, solder joint reliability, drop and vibrational damage, interfacial delamination, and the impact of moisture and environmental humidity. Acceleration factor models for different failure mechanisms are introduced. Stress analysis methods using finite element analysis (FEA) with specific applications to packaging are described.

Biography:

Xuejun Fan is a Regents’ Professor of the Texas State University System, the Mary Ann and Lawrence E. Faust endowed chair professor in the Department of Mechanical Engineering at Lamar University, Beaumont, Texas. He received his Ph.D. degree in solid mechanics from Tsinghua University, Beijing, China in 1989. His interests and research lie in the area of modeling, characterization, and reliability in heterogeneous integration in microelectronics. Dr. Fan had extensive experience in the semiconductor packaging industry, such as with Intel Cooperation, Philips Research, and the Institute of Microelectronics (IME), Singapore. Dr. Fan received the Outstanding Sustained Technical Contribution Award in 2017, and the Exceptional Technical Achievement Award in 2011 from IEEE Electronics Packaging Society (EPS). He is an Associate Editor of IEEE Transactions on Components, Packaging and Manufacturing Technology and Microelectronics Reliability. Dr. Fan is an IEEE Fellow and a Distinguished Lecturer. He serves as chair, co-chairs, and committee members of various conferences such as ECTC, EPTC, ESTC, EuroSimE, ICEPT, ESREF, and EMPT. He has published more than 300 papers, including 4 books, over 100 journal papers, many book chapters, and numerous conference papers. Dr. Fan currently serves as a member-at-large of the IEEE Electronic Packaging Society (EPS) Board of Governors, and a co-chair of Modeling and Simulation in Heterogeneous Integration Roadmap (HIR).