Tutorial: Reliability Testing and Design for Reliability of Packaging Interconnects

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-- 2-Hour Short Course: lead-free solder joints, power creep, viscoplasticity, temperature, strain rate, constitutive equations, thermal-cycling, examples, recommendations  ...


Recent advances and trends in lead-free solder joint reliability are presented in this study. Emphasis is placed on the design for reliability (DFR) and reliability testing and data analysis, including: Norton power creep constitutive equations and examples; the Wises two power creep constitutive equations and examples; the Garofalo hyperbolic sine creep constitutive equations and examples; and the Anand viscoplasticity constitutive equations and examples, with temperature and strain rate-dependent parameters. For reliability testing and data analysis, the Weibull and lognormal life distributions for lead-free solder joints under thermal-cycling and drop tests;  the true Weibull slope, true characteristic life, and true mean life; and the linear acceleration factors for various lead-free solder alloys based on frequency and maximum temperature, dwell time and maximum temperature; and frequency and mean temperature will be presented. Some recommendations will also be provided.



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  • Date: 05 Jan 2023
  • Time: 08:00 AM to 10:00 AM
  • All times are (UTC-08:00) Pacific Time (US & Canada)
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  Speakers

John H Lau John H Lau of Unimicron Corp.

Topic:

Reliability Testing and Design for Reliability of Packaging Interconnects

Recent advances and trends in lead-free solder joint reliability are presented in this study. Emphasis is placed on the design for reliability (DFR) and reliability testing and data analysis, including: Norton power creep constitutive equations and examples; the Wises two power creep constitutive equations and examples; the Garofalo hyperbolic sine creep constitutive equations and examples; and the Anand viscoplasticity constitutive equations and examples, with temperature and strain rate-dependent parameters. For reliability testing and data analysis, the Weibull and lognormal life distributions for lead-free solder joints under thermal-cycling and drop tests;  the true Weibull slope, true characteristic life, and true mean life; and the linear acceleration factors for various lead-free solder alloys based on frequency and maximum temperature, dwell time and maximum temperature; and frequency and mean temperature will be presented. Some recommendations will also be provided.

Biography:

John H Lau, with more than 40 years of R&D and manufacturing experience in semiconductor packaging and SMT assembly, has published more than 515 peer-reviewed papers (375 are the principal investigator), 40 issued and pending US patents (25 are the principal inventor), and 23 textbooks (all are the first author) on, e.g., , Through-Silicon Via (TSV) for 3D Integration (McGraw-Hill, 2013), 3D IC Integration and Packaging (McGraw-Hill, 2016), Fan-Out Wafer-Level Packaging (Springer, 2018), Heterogeneous Integration (Springer, 2019), Semiconductor Advanced Packaging (Springer, 2021), and Chiplet Design and Heterogeneous Integration Packaging (Springer, 2023). John is an elected IEEE fellow, IMAPS Fellow, and ASME Fellow, and has been actively participating in industry/academy/society meetings/conferences to contribute, learn, and share.