IEEE 802.11: A Look Under the Hood
Claudio Da Silva: IEEE 802.11: A Look Under the Hood
In this talk, Claudio Da Silva will give an overview to the 802.11 standard and Wi-Fi, including WiFi 7 and the next evolution of the IEEE 802.11 Standard
Date and Time
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- Date: 10 Oct 2023
- Time: 09:00 AM to 11:00 AM
- All times are (UTC-05:00) Bogota
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- Universidad de Antioquia
- Medellin, Antioquia
- Colombia
- Building: 21
- Room Number: 21-326
- Click here for Map
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- Co-sponsored by Universidad de Antioquia
- Starts 16 September 2023 08:00 AM
- Ends 10 October 2023 08:00 AM
- All times are (UTC-05:00) Bogota
- No Admission Charge
Speakers
Claudio da Silva
IEEE 802.11: A Look Under the Hood
Biography:
Dr. Claudio da Silva is a Wireless Systems Engineer in the Reality Labs group of Meta Platforms (formerly Facebook) and is responsible for the standardization of wireless connectivity technologies and for advancing Meta’s spectrum policy strategy. He also serves as the Technical Editor of IEEE 802.11bf (WLAN Sensing), a task group currently developing an IEEE 802.11 amendment that enhances Wi-Fi sensing technology, and as an IEEE ComSoc Distinguished Lecturer for the 2022-2023 term.
Before joining Meta Platforms, Dr. da Silva was with the Next Generation & Standards group of Intel Corporation, where he was responsible for driving technology and product innovation by leading and contributing to various standardization, certification, and regulatory activities. During his tenure at Intel, he served as the Technical Editor of Wi-Fi Alliance's 60 GHz TTG from 2019 to 2021. Before Intel, he worked on cellular modem implementation and applied research at Samsung Mobile Solutions Lab. The first years of his professional career were spent at Virginia Tech, where he was an Assistant Professor in the Bradley Department of Electrical and Computer Engineering.
Dr. da Silva received the B.S. and M.S. degrees from the State University of Campinas, Brazil, in 1999 and 2001, respectively, and the Ph.D. degree from the University of California, San Diego in 2005, all in electrical engineering. He was an Editor for Modulation and Signal Design for the IEEE Transactions on Communications from 2012 to 2015, and has served on the technical program committee of numerous IEEE conferences in the communications area. He is a Senior Member of the IEEE.
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Address:United States
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