Additive Manufacturing: Packaging Applications and Growth Needs for Heterogeneous Integration Impact [remote/no fee]
-- current practices, materials, capabilities, HI applications, challenges ....
[this is a no-charge online event]
This talk will cover major developments within additive manufacturing as applied towards electronics packaging needs generally and especially for heterogeneous integration applications, as well as overview the benefits and growth needs for these manufacturing approaches to have impact within our future electronic devices.
Date and Time
Location
Hosts
Registration
- Date: 01 Feb 2024
- Time: 12:00 PM to 01:00 PM
- All times are (UTC-08:00) Pacific Time (US & Canada)
-
Add Event to Calendar
- Starts 28 November 2023 06:09 PM
- Ends 01 February 2024 12:45 PM
- All times are (UTC-08:00) Pacific Time (US & Canada)
- Admission fee ?
Speakers
Kris of Reality Labs Research
Biography:
Kris Erickson is a Materials Research Manager at Reality Labs Research, based in Redmond, Washington, where he leads a team developing materials for the next generation of Mixed Reality devices. Kris received his PhD in Chemistry at UC-Berkeley, was a post-doctoral appointee at Sandia National Labs’ Materials Physics group, and was a Research Scientist and Manager at HP Labs where he researched and lead teams developing novel solutions in the spaces of Polymer 3D Print, Metal 3D Print, and 3D Printed Electronics.