Using Diamond in Advanced Packaging: Current Developments and Status [remote/no fee]

---

---

[this is a no-charge online event]

Joana Mendes will present a detailed background on current status of diamond film development. Artificial diamond films are deposited from a mixture of methane and hydrogen — and the deposition of the material is not an expensive process. However, the integration of diamond films and electronic devices requires the development and optimization of new processing lines, which is a costly procedure. LEDs, for instance, have become low-cost components. Are manufacturers willing to trade the current low cost for higher efficiency/performance and longer lifetime? Specific upcoming possibilities are for HEMT packaging, 5G/6G RF modules in cell phones, and in heterogeneous integration such as for high-power SiP modules.
The second talk: Diamond Foundry, Inc. produces CVD single-crystal diamond (SCD) at scale, and recently achieved the historic milestone of the creation of the world’s first 100mm SCD wafer. SCD as heat spreader achieves performance enhancements of 3-6x and temperature reductions of 65C due to its unmatched high isotropic thermal conductivity (2,200W/m-K). Jeroen van Duren will describe the manufacturing of SCD dies and wafers and use for AI and power electronics packaging 

 

---

---

---

---