Nanopackaging for AI, power delivery and THz solutions
Foundations for advancing wireless networks rely on the exploration of high-frequency bands ranging from 30 GHz to 300 GHz. FutureG and THz communication technologies enable access to these bands with improved spectral efficiency and bandwidth. However, these trends also present significant challenges for future electronic systems. These are associated with design for higher gain and bandwidth to address higher pathlosses, interconnect losses between the transceiver and the antenna array, higher power consumption because of hardware complexity, thermal management for higher power dissipation, limited manufacturability because of the new set of required materials, high functional density in multilayered substrates, and high production costs. Nanopackaging enables key solutions to many of these challenges by bringing advanced packaging and device materials, interfaces and package architectures to manage the complex system requirements for THz communications. These include nanoscale reconfigurable systems with tunable components, THz arrays and detectors, metasurfaces and seamless heterogeneous integration with low-loss conductors, shielding structures, thermal interfaces and heat-spreaders. This webinar reviews the key nanopackaging advances that are making FutureG and THz systems a reality.
Speakers: Prof. Premjeet Chahal (MSU) and Prof. Nezih Pala (FIU)
Moderator: Dr. Atom Watanabe (IBM)
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- Date: 10 Jan 2024
- Time: 11:00 AM to 12:00 PM
- All times are (UTC-05:00) Eastern Time (US & Canada)
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Speakers
Dr. Prem Chahal
Nanopackaging FutureG/THz Solutions
Biography:
Prem Chahal joined Michigan State University, East Lansing, MI, USA, in 2009, as a Faculty Member, where he has been an Associate Professor since 2015. His current research interests include blockchain, terahertz technology, millimeter-wave electronics, RF-based sensors, RF MEMS, RF-optical devices, and microwave and millimeter-wave systems packaging. Dr. Chahal was a recipient of the 2012 DARPA Young Faculty Award and the 2016 Withrow Teaching Excellence Award. His interests are in Terahertz (THz) and Millimeter-wave Electronics, IR Sensors, Microsystems Packaging, RF-MEMS, BioMEMS, and Flex Electronics. He has been a EPMD Program Director at NSF since 2021 where he is responsible for programs such as ASCENT, FuSE, ACED fab and EPMD.
Dr. Nezih Pala
Nanopackaging FutureG/THz Solutions
Biography:
Nezih Pala is currently a Professor at the Electrical &Computer Engineering Department of Florida International University. He received his B.S. degree from Middle East Technical University, Ankara, Turkey in 1996 with honors, M.S. and PhD degrees in Electrical Engineering from Rensselaer Polytechnic Institute, Troy, NY in 1999 and 2002, respectively. His research interests include design, fabrication and characterization of nanoscale materials, devices and systems for electronic, photonic and plasmonic applications in bio/chemical sensing, imaging, communication, energy harvesting, terahertz technologies as well as visible light communication. His research has been supported by NSF, US Army, NIH, Department of Energy, EPA, Florida Light & Power Inc. and internationally by Qatar National Research Fund. He is a recipient of NSF CAREER award. He has authored/coauthored more than 250 articles published in peer reviewed scientific journals and conferences, 6 book chapters, 11 US patents.