58th IEEE EPS Japan Chapter Evening Meeting
58th IEEE EPS Japan Chapter Evening Meeting ~ Special Session from ECTC 2023 ~
Date and Time
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- 7-7 Shinkawasaki
- Saiwai-ku
- Kawasaki, Kanagawa
- Japan 212-0032
- Building: AIRBIC
Agenda
16:05-16:30 Development of Fluxless Micro-Bonding and Narrow Gap Filling Process
Mr. Sadaaki Katoh (Resonac Corporation)
16:30-16:55 50 nm Overlay Accuracy for Wafer-to-wafer Bonding by High-precision Alignment Technologies
Mr. Hajime Mitsuishi (NIKON CORPORATION)
16:55-17:20 Innovative Fan-Out Embedded Bridge Structure for Co-Packaged Optics
Dr. Jay Li (SPIL)
17:30-17:55 A Scalable Heterogeneous AiP Module for a 256-Element 5G Phased Array
Dr. Atom O. Watanabe (IBM Corporation)
17:55-18:20 A New Millimeter-wave Package Design Based on Pseudo-cavity Mode Electromagnetic Wave Excitation Using 400-μm Core FCBGA
Mr. Ryuichi Oikawa (Renesas Electronics Corporation)