Distinguished Lecturer Program on Thermal Centric Design Methodologies for Monolithic 3D Integrated Circuits
The Distinguished Lecturer Program started with the Welcome Address and Introduction of the Resource Person by Ms. S,Usha, Advisor, IEEE Circuits and Systems Society, Sri Sairam Engineering College. Next, the session was taken over by Prof. Emre Salman. 90 participants attended this DLP.
Monolithic 3D integration represents a promising avenue for advancing integrated circuit (IC) technology, offering enhanced performance and functionality in a compact footprint. Thermal management is a critical aspect of Monolithic 3D IC design due to increased heat density resulting from vertical stacking of device layers. Design methodologies focusing on thermal-centric approaches aim to mitigate thermal challenges while optimizing performance and reliability. These methodologies encompass various techniques such as thermal-aware floorplanning, placement, and routing to ensure efficient heat dissipation and temperature uniformity across the 3D IC. Advanced thermal simulation tools and models play a crucial role in predicting and analyzing thermal behaviour at different design stages. Thermal-aware design optimization algorithms are employed to balance trade-offs between thermal, electrical, and physical constraints, maximizing overall system performance. Integration of microfluidic cooling solutions and novel materials with high thermal conductivity further enhances thermal management in Monolithic 3D ICs. Collaborative efforts between design, packaging, and thermal experts are essential for developing holistic approaches to thermal-centric design in Monolithic 3D ICs.By prioritizing thermal considerations throughout the design process, thermal-centric methodologies pave the way for the development of next-generation Monolithic 3D integrated circuits with improved performance, reliability, and energy efficiency.
He also answered the queries asked by our students. The vote of thanks was proposed by Mr. Ramakrishnan Sriram, third year ECE student of our college.
We take this opportunity to thank our CEO sir, Principal sir, Dean (Academics) and HOD-ECE Dr. J.Raja sir for their support and guidance towards the successful completion of this Distinguished Lecturer Program.
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- Date: 08 Apr 2024
- Time: 07:00 PM to 08:00 PM
- All times are (UTC+05:30) Chennai
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Speakers
Prof. Emre Salman of Electrical and Computer Engineering Department, Stony Brook University, New York
Thermal Centric Design Methodologies for Monolithic 3D Integrated Circuits
Biography:
Emre Salman Received the B.S. degree in microelectronics engineering from Sabancı University, Istanbul, Turkey, in 2004, and the M.S. and Ph.D. degrees in electrical engineering from the University of Rochester, New York, in, respectively, 2006 and 2009. Between May 2009 and September 2010, he worked as a postdoctoral research associate at the University of Rochester. He also worked and conducted research at STMicroelectronics, Synopsys, and Freescale Semiconductor. Since September 2010, he has been an Assistant Professor with the Department of Electrical and Computer Engineering, Stony Brook University, New York, where he is the director of the Nanoscale Circuits and Systems (NanoCAS) Laboratory. His broad research interests include analysis, modeling, and design methodologies for nanoscale integrated circuits in both 2-D and 3-D technologies.
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