Jonathan Kordell of Ansys

Introduction to Electronics Reliability

Electronics packaging reliability has become an inescapable topic for the defense, healthcare, consumer electronics, and communication industries. And as packaging technologies continue to push limits, understanding the fundamental reliability concepts is becoming increasingly important. This webinar will cover the common overstress and wear-out failure mechanisms found in electronic packages, including fracture, fatigue, wear, time dependent dielectric breakdown, and more. The discussion will include a description of the failure, common life-stress models, and how these models can be applied to state-of-the-art package architectures.

Biography:

Jonathan Kordell is a Senior Reliability Consulting Engineer at Ansys with 8 years of experience in electronic packaging reliability, accelerated testing and failure analysis. His current role is focused on the reliability of electronic devices in a range of environments via a combination of physical characterization and analytical modeling including finite element analysis. Jonathan received his PhD in mechanical engineering from the University of Maryland at the Center for Advanced Life Cycle Engineering (CALCE).