The increasing high requirements of wireless communications and sensors are making research and commercialization of millimeter-wave integrated circuits and antennas experience tremendous growth. The advancement of modern CMOS technology facilitates it to become the prevailing technology to achieve low-cost and highly-integrated millimeter-wave integrated circuits. Meanwhile, the compound semiconductor is still a must for low noise and high power millimeter-wave system.

As the operating frequency enters the millimeter-wave regime, the circuit component’s size becomes comparable to the electromagnetic wave wavelength. Therefore, a mixed design methodology using both the lumped and distributed elements in the millimeter-wave integrated circuit design is of great interest, not only compound semiconductor but also CMOS integrated circuits. On one hand, to achieve high-integration and high-performance, the heterogeneous packaging architecture to combined the merits of both CMOS and compound semiconductor millimeter-wave integrated circuits is becoming an attractive technology. On the other hand, considering the efficiency, cost, and integration of advanced wireless systems, discrete antenna is no longer suitable for millimeter-wave wireless systems. Therefore, antenna-in-package (AiP) has become the mainstream for millimeter-wave system, which implements an antenna or antennas on (or in) package of chips leading to a high efficiency and highly-integrated radio.

In the talk, innovative design approaches and methodologies on millimeter-wave integrated circuits, subsystems and corresponding antenna-in-package will be introduced.

This presentation is open to all and both experienced and novice level engineers are welcome to attend.