Dr Farhana Sheikh of Intel

The number of connected devices is expected to reach 500 billion by 2030, which is 59-times larger than the expected world population. Objects will become the dominant users of next-generation communications and sensing at untethered, wireline-like broadband performance, bandwidths, and throughputs. This sub-terahertz 6G communication and sensing will integrate security and intelligence. It will enable a 10x to 100x increase in peak data rates. FPGAs are well positioned to enable intelligent radios for 6G when coupled with high-performance chiplets incorporating RF circuits, data converters, and digital baseband circuits incorporating machine learning and security.  This talk presents use of 2.5D and 3D heterogeneous integration of FPGAs with chiplets, leveraging Intel’s EMIB/Foveros technologies with focus on one emerging application driver: FPGA-based 6G sub-THz intelligent wireless systems.  Nano-, micro-, and macro-3D heterogeneous integration is summarized, and previous research in 2.5D chiplet integration with FPGAs is leveraged to forge a path towards new 3D-FPGA based 6G platforms.  Challenges in antenna, packaging, power delivery, system architecture design, thermals, and integrated design methodologies/tools are briefly outlined. Opportunities to standardize die-to-die interfaces for modular integration of internal and external circuit IPs are also discussed.

Biography:

Dr. Farhana Sheikh is a Principal Engineer at Intel’s Programmable Solutions Group.  She has over 15 years of experience in ASIC and DSP/communications research including adaptive DSP, crypto, graphics, quantum wireless control, and 5G+ wireless. Since joining PSG, after 10+ years in Intel Labs, Farhana’s research focuses on 2D and 3D chiplet + FPGA integration research, with a focus on 3D heterogeneous integration for next generation wireless and sensing applications. Farhana has published over 50 papers and filed 22 patents, has initiated the AIB-3D open-source specification for 3D chiplet heterogeneous integration.  Farhana was instrumental in enabling Intel 16 for Intel’s IDM2.0 and is the co-creator of Intel’s University Shuttle Program.  Outside of Intel she volunteers for IEEE Solid-State Circuits Society (SSCS) and is the SSCS Women in Circuits Committee Chair.  Farhana is a co-recipient of 2020, 2019, and 2012 IEEE ISSCC Outstanding Paper Awards. In 2021, Farhana was recognized for her mentorship work with students and faculty by the Semiconductor Research Corporation (SRC) that awarded her the 2021 Mahboob Khan Outstanding Industry Liaison Award. She is IEEE SSCS Member-at-Large for 2022-2024, and IEEE SSCS Distinguished Lecturer for 2023 and 2024

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