The Application of Simulation and Artificial Intelligence in Advanced Packaging

#AI #digital #twin #simulation #heterogeneous #integration #2.5D #3D
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-- heterogeneous integration, development cycle, yield enhancement, modeling, digital twins, virtual representation ...

Advanced Packaging enables heterogeneous integration of chiplets with die-embedding and die-stacking techniques, and provides maximum device performance with a much faster product development cycle. However, as the 2.5D and 3D packages are getting more and more complicated, it is very challenging to ramp the yield and assure the reliability of new products within this short timeline using conventional methods. Artificial Intelligence (AI)-assisted design co-optimization, manufacturing process simulation and monitoring, yield enhancement, reliability assurance, and failure mode prediction, which were developed for Si fabrication, could be employed to shorten the advanced packaging development cycle. This presentation summarizes the current status for the various applications of simulation and AI in advanced packaging. Further development trends are highlighted with the goal of providing a holistic and robust virtual representation, or digital twin, for advanced packaging.


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  • Date: 24 Oct 2024
  • Time: 12:00 PM to 01:00 PM
  • All times are (UTC-07:00) Pacific Time (US & Canada)
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  • Starts 01 August 2024 12:00 AM
  • Ends 24 October 2024 01:00 PM
  • All times are (UTC-07:00) Pacific Time (US & Canada)
  • No Admission Charge

  Speakers

Yan Li of Samsung Electronics

Biography:

Dr. Yan Li received her Ph.D. degree in Materials Science and Engineering from Northwestern University in 2006, and her M.S and B.S degree in Physics from Peking University. After more than 17 years at Intel in Arizona focusing on advanced packaging technology developments, she joined Samsung Advanced Packaging group in San Jose as a Principal Engineer in 2023. Dr. Li has been an active member of Minerals Metals and Materials Society (TMS), the Institute of Electrical and Electronics Engineers (IEEE), American Society for Metals (ASM), and Electronic Device Failure Analysis Society (EDFAS). She has been appointed as an organizer for TMS and the International Symposium for Testing and Failure Analysis (ISTFA) annual conferences since 2011, served on the EDFAS board member since 2019, and has been EDFAS vice president since 2024. Dr. Li has published over 20 papers and holds two patents in the microelectronic packaging area. She is an associate editor of “Microelectronics Reliability” and the co-editor of three semiconductor industry highly recognized books on 3D Microelectronic Packaging and Autonomous Vehicles.