GE/BU/IBM Electronics Packaging Symposium : vTools Events

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GE/BU/IBM Electronics Packaging Symposium

#electronics #packaging #heterogeneous #integration #CHIPS #Thermal #5G #Flexible #hybrid #wearable #HPC #Automotive #power #substrates #HIR #photonics

Binghamton University, GE Global Research and IBM Research are proud to host the 34th Annual Electronics Packaging Symposium

— Small Systems Integration. The program will include two days of exciting invited presentations with a focus on supply chain interconnectivity.

We invite you to join us for this event on Sept. 4-5, 2024, at the Binghamton University ITC Complex. We look forward to seeing you in person.

The symposium brings together leaders in academia, industry and government to network and discuss the latest advances in the field of electronics packaging, and to bring value from the varying viewpoints of each respective sector.

The program will also include keynote presentations and student poster sessions. The goal of the symposium is to have those who attend walk away with insight, career-building opportunities, and the knowledge of having been an integral member in the advancement of the electronics packaging field.

Session topics will include: future of computing for HPC/AI, flexible, additive and wearable electronics, heterogeneous integration, photonics packaging, thermal challenges, advanced substrates and power electronics.

Also planned are two special panels, the first is a panel to address workforce development challenges to support the CHIPS and Science Act and the second panel to review the new NIST sponsored Heterogeneous Integration Roadmaps, what each of the 4 roadmaps are, where they are focused and how they will help NIST and the electronics packaging industry identify gaps to supporting future packages.

Symposium agenda can be found at https://www.binghamton.edu/ieec/eps/agenda.html