EPS Chapter Meet-and-Greet
-- social, Valley experts, heterogeneous integration, hybrid bonding, build-up substrates, quantum computing, Sr Member upgrades ...
The IEEE EPS (SCV, SF, OEB) is excited to be hosting a 'Meet & Greet' (an in-person event in Milpitas, CA) for those in the fields of semiconductor packaging. This is a unique opportunity for the packaging professionals in the Valley to find out more about our committees, hear about upcoming events (online and in-person), connect and network with local experts in materials, advanced packaging, production, and reliability.
The organizers also plan to have quickfire presentations/discussions on some of the enabling technologies that have helped and will continue to spur the evolution of AI around us. The topics for discussion include Heterogeneous Integration, Hybrid Bonding, Build-Up Substrates and Quantum Computing. We'll also touch on some aspects of IEEE Membership, its benefits, opportunities for Member Elevation, and guidance if one were interested to pursue becoming a Senior Member.
Food and drinks will be served -- come enjoy this time together!
Date and Time
Location
Hosts
Registration
- Date: 14 Nov 2024
- Time: 04:30 PM to 07:00 PM
- All times are (UTC-08:00) Pacific Time (US & Canada)
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- SEMI World Headquarters
- 673 South Milpitas Blvd
- Milpitas, California
- United States 95035
- Starts 26 September 2024 12:00 AM
- Ends 14 November 2024 04:00 PM
- All times are (UTC-08:00) Pacific Time (US & Canada)
- No Admission Charge