Joint Pikes Peak Electronic Devices/Circuits and Systems and Life Member Affinity Group Meeting

#Moore's #Law #Beyond #Moore #3D #Memory #Packaging #HBM
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Beyond Moore: 3D Memory, 3D Packaging

David Bondurant, Retired PE, President of Vertical Memory

“If we make them smaller, we can make them faster” has been the approach to building faster computers over the last 70-years starting with the first transistors and continuing as we built increasingly more complex integrated circuits.  This was known as “Moore’s Law”.  Recently, our technology is no longer achieving higher densities as we scale to smaller features sizes first with NAND Flash and now with SRAM and DRAM.  New techniques known as Beyond Moore are require to continue to build faster and more complex computers.  I review the emergence of 3D memory and 3D packaging as today’s approach to building the fastest Supercomputers and AI Processors.

Lunch will be provided by the Pikes Peak LMAG



  Date and Time

  Location

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  Registration



  • Date: 24 Oct 2024
  • Time: 12:00 PM to 01:30 PM
  • All times are (UTC-06:00) Mountain Time (US & Canada)
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  • 1420 Austin Bluffs Pkwy
  • Co, Colorado
  • United States 80918
  • Building: Engineering Building
  • Room Number: Tom Saponas Lounge (2nd Floor)

  • Contact Event Hosts
  • Starts 30 September 2024 12:00 AM
  • Ends 24 October 2024 12:00 AM
  • All times are (UTC-06:00) Mountain Time (US & Canada)
  • No Admission Charge


  Speakers

David Bondurant of Vertical Memory

Topic:

Beyond Moore: 3D Memory, 3D Packaging

Biography:

David Bondurant has been involved with the computer and semiconductor industry for 53-years.  He was a computer architect at Control Data, Sperry-Univac, and Honeywell.  He was involved with the government-sponsored advanced semiconductor program called VHSIC (Very High Speed Integrated Circuits) at Univac & Honeywell where he developed microprocessor and ASIC semiconductor products in bipolar CML, CMOS, and radiation hard CMOS.  He was involved with emerging non-volatile RAM and high performance DRAM marketing at industry leading companies, Ramtron (FRAM), Enhanced Memory Systems (EDRAM, ESRAM), Simtek (non-volatile SRAM), and Freescale Semiconductor/Everspin Technologies (MRAM) as they became viable over the last 30-years. He has consulted on memory and system-on-chip technologies for 20-years.

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Agenda

Lunch 

Presentation