IEEE/EPS Hybrid Bonding Symposium

#heterogeneous #integration #hybrid #bonding
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-- Enabling Hybrid Bonding Commercialization: performance, technology, materials, equipment, reliability ...

Hybrid Bonding has emerged as the technology of choice in the semiconductor industry for ultra-fine-pitch interconnection. With significant benefits for interconnect density and device performance, it will become widely adopted for a broad range of high-performance semiconductor devices in the years to come. The success of Hybrid Bonding technology for high-volume manufacturing depends critically on the process technology as well as materials and equipment. Design, performance characterization, thermal management and reliability are also important considerations to enable applications in various areas.

Join us to learn about this expanding field, and discover how it will affect heterogeneous integration and system design.


  Date and Time

  Location

  Hosts

  Registration


  • Start time: 16 Jan 2025 08:00 AM
  • End time: 17 Jan 2025 05:00 PM
  • All times are (UTC-08:00) Pacific Time (US & Canada)
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  • SEMI World Headquarters
  • 673 South Milpitas Blvd
  • Milpitas, California
  • United States
  • Contact Event Host
  • Starts 27 September 2024 12:00 AM
  • Ends 17 January 2025 12:00 PM
  • All times are (UTC-08:00) Pacific Time (US & Canada)
  • Admission fee ?
  • Menu: Standard, Vegetarian

  Speakers

Topic:

Advance Program

Confirmed talks (as of September 30) include Hybrid Bonding Process Technology (Guilian Gao, 3D Packaging, Adeia); Hybrid Bonding Innovations: Ultra-Low-Temperature Cu-Cu Bonding Based Passivation Technology and HRDL Platform Development for RDL Interposer Applications (Prof. Kuan-Neng Chen, NYCU); Planarization for Advanced Packaging and Hybrid Bonding (Brian J. Brown, VP-Engineering, Applied Materials); Permanent and Temporary Wafer Bonding (Viorel Dragoi, EV Group); Die to Wafer Hybrid Bonding for Direct Copper Interconnection (Jonathan Abdilla, BESI); Characterization, Modelling and Reliability for Direct Copper Interconnection (Dongkai Shangguan, Thermal Engineering Associates); Materials for Hybrid Bonding (Andrea Chacko, Brewer Science).

Please check our website in November for the full program.