Semiconductor Supply Chain “Eco System” Overview

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-- pyramid model, main players, upstream & downstream, chip design, tools, packaging, test, markets ...


At the end of 2023 the semiconductor market had increased from $532 Billion in 2023 to $611 B mid-year 2024. This growth is viewed positively in the light of the recent Covid pandemic and ongoing supply chain disruptions. Since disruptions (all kinds) in the semiconductor supply chain are not going away, the semiconductor companies must ensure that their entire supply chain (SC) "eco system” is complete, efficient and resilient. Many SC experts use a pyramid to highlight the critical segments of the chip manufacturing fabrication process. Through the use of a SC pyramid, process experts highlight the essential needs and requirements, beginning to end, of the chip fabrication process eco system. 
The resulting pyramid notes the intersection of the many entities involved, upstream and downstream suppliers, associated manufacturing equipment companies, and all vendors and distributors for each segment. The eco system includes chip design, chip design verification, wafer manufacturing, key essential raw materials, packaging, and assembly and test regardless of the entity type (foundry, OSAT facility, or IDM). The final chip is then designed into a sub-assembly, device, or a system that can be sold to consumers and government agencies. A discussion of the equipment tools key to the chip fabrication process will also be presented. This will include design verification and test tools, deposition equipment, and lithography equipment.  
Summary:  The semiconductor supply chain ecosystem;  Pyramid illustration of 6 segments describing the chip fabrication process; Associated main player companies for each of the segments; Semiconductor fabrication equipment suppliers and their market share.



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  • Date: 05 Dec 2024
  • Time: 12:00 PM to 01:00 PM
  • All times are (UTC-08:00) Pacific Time (US & Canada)
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  • Starts 24 October 2024 12:00 AM
  • Ends 05 December 2024 12:00 AM
  • All times are (UTC-08:00) Pacific Time (US & Canada)
  • No Admission Charge


  Speakers

Kitty Pearsall of Capstan Technologies

Biography:

Kitty Pearsall received the BS degree in Metallurgical Engineering and her MS and PhD degrees in Mechanical Engineering and Materials from the University of Texas. Across her 41-year career at IBM, she was appointed to strategic roles in the Integrated Supply Chain while implementing global cross commodity processes/products. Kitty is now affiliated with Capstan Technologies. Kitty has been an active member of IEEE for 34 years as well as an EPS member for 29 years, with growing roles and responsibilities, including EPS Past President and a member of the EPS Board of Governors since 2005. Kitty holds 13 US Patents and 8 published IP disclosures. Kitty has been recognized by IBM with many outstanding technical awards, by the University of Texas in Austin and by the IEEE Electronic Packaging Society. She is an EPS Distinguished Lecturer, received the David Feldman Award, the IBM Distinguished Engineer in Integrated Supply Chain, was a Member of the IBM Academy of Technology, and was recognized with the IBM Women in Technology Fran E. Allan Mentoring Award.