Come join us for this Dine and Learn event hosted by the Denver Section and University of Colorado Boulder. You're invited to participate in an exciting and engaging presentation titled "From Wafers to Cutting-Edge Products: The process of Testing, Packaging, and Design" by Tim Swettlen.

Whether you're a college student eager to expand your knowledge or a technical professional looking to stay informed in this evolving industry, this presentation aims to cover the key test and assembly stages that deliver functional products to market.

* Food and beverage will be provided.

* Parking code will be provided to event registrants.

Abstract:

As Moore’s Law slows down on transistor density at the die level, advanced packaging methods are bridging the gap and continue to deliver ever more powerful products. To understand these changes, a thorough understanding of the testing flow is important as more die are stacked on a single final product.

This talk starts as the wafer exits the fab, is exposed to a battery of tests and routed to its highest value package and product. Each die on the wafer is processed on the same test flow but its testing results will direct it to different bins sold at different selling prices. These complex test flows allow the right parts to be assembled into the best final product whether it’s an advanced smart phone or an entry level AI accelerator card.