Electronics Packaging Case Studies at Binghamton University

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The Analytical & Diagnostics Laboratory (ADL), an initiative under Binghamton University’s S3IP Center of Excellence, is a centralized, interdisciplinary research facility. Partnering with the Integrated Electronics Engineering Center (IEEC), a New York State Center for Advanced Technology, the ADL advances electronics packaging, reliability, and manufacturing research. Together, they drive innovation in systems integration, flexible electronics, renewable energy, and medical devices.
   Many industry partners collaborate with us for our advanced instrumentation, stress testing capability, and failure analysis expertise. In this talk, we will review several case studies that center around these topics in microelectronics. For example, in modern high-powered applications, electromigration which has been predominately a chip level phenomenon is now a concern for circuit boards with BGA sized features. We will show the progression from test vehicle design through stress evaluation into failure characterization. Another example centers around identification of an open circuit in a functional printed circuit board. We will further elaborate on techniques used to isolate failures and identify failure mechanisms as well as the relationship between these mechanisms and typical environmental stresses.

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