Introduction to Electronic Reliability in the Age of AI
Electronics play a crucial role across all industry sectors, especially as systems become more interconnected, cloud-based, electrified, and powered by artificial intelligence (AI). This applies not only to existing electronics but also to emerging technologies pushing the boundaries of scale, data speed, power, and AI-driven innovations. Emerging technologies that are major drivers for electronics growth include Hyperscalars driven by AI and machine learning, IOT, EV and autonomous vehicles.
Generative AI has been driving demand for high performance GPU based servers and increased loads at data centers. Chip makers have in turn been focused on development of MPUs and GPUs optimized for AI. 5 and 6G applications likewise require sensing, computation and transfer of large volumes of data without latency. All these applications have been pushing electronics towards heterogenous integration with 2.5 and 3D chiplets which allow for greater speeds, functionality and smaller footprints.
However, these newer designs, materials and shrinking of scale cause thermal management and reliability issues in electronics introducing new failure sites and modes.
This seminar will focus on the critical role reliability plays in the design, manufacturing, and long-term performance of electronic systems. The presentation will start with an overview of the semiconductor supply chain, answering questions such as “who are the key players in various industries?” and “what is driving innovation and how is it taking shape?” The session will continue with addressing key foundational electronics reliability concepts such as the bathtub curve, the difference between reliability physics and handbook calculations, prognostic health management, and common failure mechanisms. Additional time will be spent describing the reliability challenges presented by advanced packaging, like 3D heterogeneous integrated packages
To address the evolving topic of electronics reliability as industry needs evolve, Ansys, in collaboration with IEEE, is hosting an Electronics reliability tutorial series that explore electronic component reliability, key electronic failure mechanism and root cause, manufacturing reliability, and simulation/testing for reliability. These tutorials are offered as bundles for continuing education credit with an electronics reliability certificate from IEEE.
Date and Time
Location
Hosts
Registration
- Date: 14 May 2025
- Time: 09:00 PM UTC to 11:00 PM UTC
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- MIT Lincoln Laboratory
- 244 Wood Street
- Lexington, New Jersey
- United States 02421
- Building: Main Cafeteria
- Starts 28 April 2025 04:00 PM UTC
- Ends 14 May 2025 09:00 PM UTC
- No Admission Charge
Speakers
Dr. Jon Kordell
Introduction to Electronic Reliability in the Age of AI
Biography:
Dr. Jonathan Kordell is a Senior Reliability Engineer at Ansys with nearly a decade of experience in electronic packaging reliability, accelerated testing and failure analysis. In his current role, he focuses on ensuring the reliability of electronic devices across various environments, utilizing a blend of physical characterization and advanced analytical modeling techniques, including finite element analysis. Dr. Kordell has tackled a diverse array of reliability challenges, supporting clients across industries such as Consumer Electronics, Aerospace, Defense, Industrial, and Medical. He earned his PhD in Mechanical Engineering from the University of Maryland’s Center for Advanced Life Cycle Engineering (CALCE). There he designed and fabricated fiber optic sensors to track fatigue precursors in mechanically loaded metals and fiber composites.
Address:United States